Nanotectonics: Direct Fabrication of All-Inorganic Logic Elements and Micro-Electro-Mechanical Systems from Nanoparticle
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Nanotectonics : Direct Fabrication of All-Inorganic Logic Elements and MicroElectro-Mechanical Systems from Nanoparticle Precursors Eric J. Wilhelm and Joseph Jacobson Massachusetts Institute of Technology, Media Lab, Cambridge, MA.
Abstract The reduced melting point and high solubility of inorganic nanoparticles have been shown to be useful in the low-temperature solution-based fabrication of semiconductor devices. These inks have been patterned using various techniques to form inorganic logic elements, multi-layer structures, and MEMS. Here we report a new technique known as offset liquid embossing that is used to print the nanoparticle inks. Structures created include multiple layers of gold and spin-on-glass printed without the need for etching or planarization, and 100 nm resolution.
Introduction Current means of manufacturing at the 100nm scale, such as the vacuum deposition and photolithographic processes used to fabricate microelectronics, require billions of dollars of infrastructure and weeks of fabrication time. These devices are made through a subtractive process: first depositing a desired material, then depositing and patterning a resist layer, and finally etching away the unwanted regions. This entire process is repeated for additional layers. Nanoparticles allow substantially simpler processing because they can be processed as liquids and sintered at temperatures only a fraction of the bulk material melting temperature, often at plastic-compatible temperatures as low as 250 C yielding high quality devices [1]. Nanoparticles precursors have been patterned by a variety of means: ink-jet printing [2], liquid embossing [3], and a new technique, discussed in this paper, called offset liquid embossing. Offset liquid embossing overcomes some of the problems inherent with liquid embossing and allows for a wider range of geometries, sharp transitions at patterned edges, and high side-walls. Like liquid embossing, offset liquid embossing is a rapid, parallel patterning process. Experimental Details Figure 1 shows a schematic of the offset liquid embossing process. A thin film of liquid is created, typically by spin coating or by doctor-blade, on an offset substrate. A stamp is made in bas-relief from poly(dimethylsiloxane) (PDMS) using standard techniques[4], and is brought into intimate contact with the thin film of liquid. Through a process thought to depend on several factors, including the surface energy of the stamp and substrate, their contact angles with the liquid film, and permeability of the thin film’s solvents in the stamp, the raised features in the stamp form a pattern in the liquid film. The stamp is removed, and the final substrate, which may be glass, plastic, silicon wafer, or the like, is then brought into contact with the pattern on the offset substrate and
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