Non-impact electrostatic micromanipulation by voltage sequence for time
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A10.5.1
Non-impact electrostatic micromanipulation by voltage sequence for time Shigeki SAITO1 , Kunio TAKAHASHI2 , and Masataka URAGO2 1 Department of Material Science and Engineering, Massachusetts Institute of Technology, 77 Massachusetts Avenue, Cambridge, MA 02139, U.S.A 2 Department of International Development Engineering, Graduate School of Science and Engineering, Tokyo Institute of Technology, 2-12-1, O-okayama, Meguro-ku, Tokyo 152-8552, Japan ABSTRACT This paper proposes how to determine a voltage sequence for time to realize a non-impact electrostatic micromanipulation by kinetic control of a detached particle. The system consists of a manipulation probe, a spherical microparticle, and a substrate plate. These objects are all conductive. The particle initially sticks to the probe tip due to adhesional force and is detached by the applied voltage. The force on the particle, which is generated by electrostatic interaction, is evaluated through a boundary element method. Although the numerical method is used, all the parameters are normalized. Based on the evaluation, we propose the simple method by accelerating and decelerating voltage, and clearly express the conditions of voltage and time by considering the total work to the particle during its flight. The discussion about the time reveals the feasibility of the method from the viewpoint of the through-rate of a power-source. INTRODUCTION Recently, there has been a great demand for micromanipulation techniques to realize highly functional microdevices. At the micro-scale, adhesional force is dominant since adhesional force is proportional to the first power of an object size, while gravitational force is proportional to the third power of the object size [1]. Adhesional phenomenon can then be used to manipulate a microparticle. For micromanipulation, repulsive force must also be generated to detach the particle. Electrostatic force is generally known to be effective to detach a microparticle as the repulsive force. Many electrostatic methods for micromanipulation have been investigated in related studies. The group of Hays investigated the adhesion and detachment of toner particles [6]. Feng et al. numerically analyzed the detachment of dielectric particles by a finite element method [7]. Mizes et al. reported the measurement and control of dielectric microparticles [8]. Egashira et al. developed a system for manipulating a microparticle using both adhesional and electrostatic forces [9]. A practical and reliable technique for the electrostatic manipulation of a microparticle is, however, still unknown. Thus, our group has numerically analyzed the system of electrostatic micromanipulation by a boundary element method to obtain the voltage required for detachment [10], and has obtained the experimental results for the real detachment voltage to support the analysis [11]. These studies provided us with the dominant parameters determining the voltage to detach a microparticle. Simultaneously, however, the kinetic control of the detached particle has been reco
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