Nondestructive Damage Evaluation of Electro-Mechanical Components Using a Hybrid, Computational and Experimental Approac
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CHSLT - Center for Holographic Studies and Laser micro-mechaTronics Mechanical Engineering Department, Worcester Polytechnic Institute Worcester, MA 01609-2280, USA ABSTRACT With the electronic industry being one of the most dynamic, in terms of new technologies, electronic packages have to be designed and optimized for new and ever more demanding applications in relatively short periods of time. This, in turn, indicates a need for effective quantitative testing methodologies. In this paper, a novel hybridized use of nondestructive, noninvasive, remote, full field of view, quantitative opto-electronic holography techniques with computational modeling is presented. The hybridization is illustrated with a representative application, which shows that the combined use of opto-electronic holography techniques and computational modeling provides an effective engineering tool for nondestructive study of electro-mechanical components. INTRODUCTION An electronic printed circuit board (PCB) is categorized as the second level of the electronic packaging hierarchyI. A PCB may contain a large number of electronic components (first level of electronic packaging) made of materials with different characteristics and properties and, therefore, each of the components behaving differently under specific loading conditions. Under actual operating conditions the PCB as well as the individual electronic components, assembled on the PCB, are subjected to electromagnetic, electrical, thermal, and/or mechanical conditions of loading, which may generate failure of an electronic package. This failure can be due to any individual or a combination of the following mechanisms: fatigue, creep, stress relaxation, stress concentration, and/or bonding fractures", 2. Reliability of an electronic package depends on the correct functionality, under operating conditions, of the components at each one of the electronic packaging levels, starting from the first level. Therefore, due to the quantity of components assembled on an electronic package and the complexity of possible failure mechanisms, reliability assessment requires the application of effective quantitative methodologies. These quantitative methodologies comprise the computational and experimental techniques. An effective study and characterization of electro-mechanical components should include the use of both computational and experimental methodologies. Computational investigations enable parametric studies and the determination of critical engineering conditions, while experimental investigations, especially optical, provide quantitative information on the actual response of the component of interest to the applied load condition 3,4. In this paper, the functionality of a first level electronic packaging component, an electronic carbon resistor, is investigated using a hybrid, computational and experimental, approach. 111 Mat. Res. Soc. Symp. Proc. Vol. 591 C 2000 Materials Research Society
EXPERIMENTAL INVESTIGATIONS Figure 1 depicts a cross sectional view of a 3 ± 3 % ohm carbon resis
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