Predictions optimal routing algorithm based on artificial intelligence technique for 3D NoC systems
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TECHNICAL PAPER
Predictions optimal routing algorithm based on artificial intelligence technique for 3D NoC systems Furat Al-Obaidy1
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Farah A. Mohammadi1
Received: 19 October 2020 / Accepted: 22 October 2020 Springer-Verlag GmbH Germany, part of Springer Nature 2020
Abstract Recently, the demand for features such as shrinkable sizes, and the concurrent need to pack increasing numbers of transistors into a single chip, have led to the utilization of hundreds of CMPs as processer elements for significant data processing, such as cloud computing systems with high performance and minimum latency-power consumption. A 3D NoC is introduced as a promising solution for the next generations of CMPs. However, there are different design issues, as selecting an efficient routing algorithm is a process which still faces some challenges. In this paper, to handle the deficiencies of the selection of the optimal routing algorithms, artificial intelligence technology is used to predict the efficient routing algorithm with higher throughput and lower power consumption. Experimental results based on the 3D NOXIM simulator are presented, and illustrate that the performance of the proposed system can predict, with high accuracy, optimal routing algorithms by switching between existing 3D routing algorithms, depending on the traffic load rate for the NoC system. The NN-prediction approach is tested under PARSEC workloads to validate the effectiveness of 3D NoC throughput, energy consumption and hotspot distribution metrics.
1 Introduction Recently, artificial intelligence technologies-based energy optimization has gained significant attention attributed to its learning ability to harness the potential power and energy in three-dimensional chip multi-processor (3D CMP) applications by predicting the optimal tasks towards enabling informed decisions under multi workloads to enhance both energy efficiency and performance. However, the utilization of a 3D CMP technology with hundreds or thousands of processing elements within chips can lead to shrinking of the length of interconnection wires, which results in considerable difficulty in overall power consumption. This, in turn, gives rise to challenges of higher chip temperature due to increased power consumption compared to other planar 2D or 2.5D designs. To validate this problem, a number of approaches have used a threedimensional Network-on-Chip (3D NoC) design as a physical and viable architecture to instantaneously & Furat Al-Obaidy [email protected] 1
Department of Electrical and Computer Engineering, Ryerson University, 350 Victoria Street, Toronto, ON M5B 2K3, Canada
introduce communication in a multi cores chip, hence a 3D NoC design as the solution to solve the issues of load traffic bottlenecks and to reduce the complexity of the on-chip design. However, the research on 3D NoCs is still under development because of several challenges which are faced in this area, such as power dissipation consumption and hotspot issu
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