3D Integration for NoC-based SoC Architectures
Back Cover Copy SERIES: Integrated Circuits and Systems 3D-Integration for NoC-based SoC Architectures by: (Editors) Abbas Sheibanyrad Frédéric Petrot Axel Janstch This book investigates on the promises, challenges, and solutions for the 3D Integration (v
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Series Editor Anantha P. Chandrakasan Massachusetts Institute of Technology Cambridge, Massachusetts
For further volumes: http://www.springer.com/series/7236
Abbas Sheibanyrad • Frédéric Pétrot • Axel Jantsch Editors
3D Integration for NoC-based SoC Architectures
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Editors Abbas Sheibanyrad TIMA Laboratory 46, Avenue Felix Viallet 38000 Grenoble France [email protected]
Axel Jantsch Royal Institute of Technology Forum 120 SE-16440 Kista Sweden [email protected]
Frédéric Pétrot TIMA Laboratory 46, Avenue Felix Viallet 38000 Grenoble France [email protected]
ISSN 1558-9412 ISBN 978-1-4419-7617-8 e-ISBN 978-1-4419-7618-5 DOI 10.1007/978-1-4419-7618-5 Springer New York Dordrecht Heidelberg London Library of Congress Control Number: © Springer Science+Business Media, LLC 2011 All rights reserved. This work may not be translated or copied in whole or in part without the written permission of the publisher (Springer Science+Business Media, LLC, 233 Spring Street, New York, NY 10013, USA), except for brief excerpts in connection with reviews or scholarly analysis. Use in connection with any form of information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed is forbidden. The use in this publication of trade names, trademarks, service marks, and similar terms, even if they are not identified as such, is not to be taken as an expression of opinion as to whether or not they are subject to proprietary rights. Printed on acid-free paper Springer is part of Springer Science+Business Media (www.springer.com)
Preface
3D integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as truly hot and broad research topics. As the end of scaling the CMOS transistor comes in sight, the third dimension may come to the rescue of the industry to allow for a continuing exponential growth of integration during the 2015–2025 period. As such 3D stacking may be the key technology to sustain growth until more exotic technologies such as nanowires, quantum dot devices and molecular computers become sufficiently mature for deployment in main stream application areas. The present book gathers the recent advances in the domain written by renowned experts to build a comprehensive and consistent book around the topics of threedimensional architectures and design techniques. In order to take full advantage of the 3D integration, the decision on the use of in-circuit vertical connection (predominantly Through-Silicon-Vias (TSVs) and Inductive Wireless Interconnects) must come upfront in the architecture planning process rather than as a packaging decision after circuit design is completed. This requires taking the 3D design space into account right from the start of the system design. Previously published books about this active research domain focus on fabrication technologies and physical aspects, rather than network and system-level architectural concerns. In contrast, the present book covers almost all architectu
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