Probing Adhesion of Metallic Nanoparticles on Polymeric Fibrous and Flat Architectures
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MRS Advances © 2018 Materials Research Society DOI: 10.1557/adv.2018.530
Probing Adhesion of Metallic Nanoparticles on Polymeric Fibrous and Flat Architectures Temitope Q. Aminu and David F. Bahr School of Materials Engineering, Purdue University, West Lafayette IN 47907, USA
ABSTRACT
The exotic characteristics of nanoscopic metallic materials bestows diverse functionalities that are increasingly being utilized for a broad range of applications. Polymer substrates present robust architectures for nanoparticle anchoring as well as modulating attendant size-induced aggregation. However, in principle, interfacial adhesion of a polymer-metal material system is weak, making the susceptibility to delamination a challenge. We have deposited copper particles on model polymer thin film and fibrous architectures to study adhesion behavior on these distinct geometries. The average sizes of copper nanoparticles deposited on electrospun fibers for metallization times of 3 and 5 minutes were 13 and 10 nm, whereas the metal island sizes under same metallization times on thin films was 79nm and 81nm. Scratch tests using a nanoindentation system were unable to generate macroscopic film delamination, but did exhibit apparent removal of individual particles, with adhesion forces of 14.9µN, 36µN, and 28.8µN obtained for films metallized for 1, 3, and 5 minutes respectively. Macroscopic tensile testing of fiber mats showed the metallization maintains conformity with the polymer ligament, albeit, with intermittent fracture of the conformal metal coating, signifying substantial adhesion exists between the metallic layer and the PAN fiber.
INTRODUCTION Metallic nanostructures have been identified as possessing quintessential properties for sensor design, catalysis, potent bactericidal treatments and target-specific drug administration [1]. Paradoxically, some specific properties like high surface area/energy and reactivity that make these materials functionally attractive, can also undermine their application: the spontaneous drive to reduce surface energy causes particle coalescence,
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lowering operational efficiency. However, metallic nanoparticles can be stabilized and immobilized on polymeric architectures due the presence of functional groups [2] as well as amenable chain structures. Even so, because of the fundamental distinctions in the molecular configurations of polymers and metals, adhesion between these metallic nanostructures and polymeric substrates is predictably weak. In this work, we utilized an electroless deposition technique, preceded by a surface activation process, for the spontaneous precipitation and uniform coverage of copper nanoparticles on planar (films) and non-planar (fibers) geometries. We investigate the adhesion characteristics on these different polymer morph
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