Progress in materials and processes of multilayer power inductors
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REVIEW
Progress in materials and processes of multilayer power inductors Hsing‑I. Hsiang1 Received: 31 May 2020 / Accepted: 5 August 2020 © Springer Science+Business Media, LLC, part of Springer Nature 2020
Abstract Passive components have continuously improved in recent years in miniaturization, multi-functionality, performance, and energy efficiency. The requirements of portable devices, home appliances, automobiles, industrial equipment, and other products demand these improvements. The passive components used in these products have had to continuously become smaller and thinner to meet ever-higher performance requirements. During the last several years, the demand for power inductors with high-rated current has increased rapidly due to the diversification and reduction in operating voltage in portable electronic devices. The low-temperature firing NiCuZn ferrites and Fe-based alloy powders for inductors have attracted much attention in recent years, while the review of the materials and processes for multilayer power inductors has not been described in the open literature to our best knowledge. Therefore, this article is aimed to deliver an overview on the progress of the multilayer power inductors, from materials and processes’ point of view.
1 Introduction As portable electronic products continue developing toward multi-function, the circuits are powered with different operating voltages. In order to solve the unstable supply voltage problem, the current design trend of power supply lines is to place the power supply as close to the integrated circuit (IC) as possible to avoid the voltage fluctuation caused by the wiring resulting from the resistance or parasitic inductance. Therefore, at present, almost all ICs are developing with independent power supply, which also makes portable electronic devices increasingly demand for miniaturized power modules. In recent years, the power technology for portable electronic products has changed from a traditional concentrated power circuit using only one DC–DC converter to using a point of load (POL) and close to the processor. Several smaller DC–DC converters form a multiphase power circuit to provide stable power for IC. For example, the operating voltages of LCD drive circuits, power amplifier modules, and baseband ICs in smart phones are different. Therefore, many DC–DC converters are needed to convert the voltage supplied by the battery into the voltage required by each * Hsing‑I. Hsiang [email protected] 1
Department of Resources Engineering, National Cheng Kung University, Tainan 70101, Taiwan
individual circuit block in the system, as shown in Fig. 1 [1]. DC power converters will grow at a rate of more than 5–10% in the next few years, especially the demand for small DC power converters for portable electronic products. In addition, in response to meet the trend of miniaturization of semiconductors, the power voltage has also continued to develop toward low voltages. At the same time, the failure probability due to small change in supply voltage h
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