Application of a Chemically Adsorbed Monolayer and polypyrrole Thin Film for Increasing the Adhesion Force between the R
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1134-BB01-09
Application of a Chemically Adsorbed Monolayer and polypyrrole Thin Film for Increasing the Adhesion Force between the Resin Substrate and the Plated Copper Layer Yuji Ohkubo 1, Shogo Onishi 1, Satoshi Miyazawa 2 , Kazuhiro Soejima 2 and Kazufumi Ogawa 1 1
Department of Advanced Materials Science, Graduate school of engineering Kagawa University, Hayashi-cho, Takamatsu city, Kagawa 761-0396, Japan
2
Business Development HQ Process Technology Dvlpmt.Center, Alps Electric Co., Ltd. 3-31, Akedori, Izumi-ku, Sendai city, Miyagi 981-3280, Japan
ABSTRACT A chemically adsorbed monolayer containing pyrrolyl group (Pyrrolyl-CAM) was prepared between a plated copper layer and a resin substrate for increasing the adhesion force without roughening a surface of the resin substrate. Although it was not enough to increase the adhesion force between the resin substrate and the copper layer by using only Pyrrolyl-CAM, the sufficient adhesion force was obtained by preparing a polypyrrole thin film between Pyrrolyl-CAM and the copper layer. Pyrrolyl-CAM and the polypyrrole thin film on the substrate were evaluated by an automatic contact angle meter and auger electron spectroscopy in order to analyze the condition of the films between the resin substrate and the copper layer. The peel strength test was carried out in order to evaluate the adhesion force. The best adhesion force was 0.98 [N/mm], and the target value of 0.60 [N/mm] was sufficiently achieved. INTRODUCTION In recent years, high density integrated circuit, miniaturization of electronic components and improvement of printed-wire board play roles as high functionalizing and weight saving of electronic devices. The printed-wire board is made of a resin substrate and a copper film laminated, and patterned by an etching technique. Although the adhesion force between the copper film and the resin substrate is important in this process, the adhesion force between the organic and inorganic materials is not usually good. Therefore, oxidative solutions are traditionally used for roughing the surface of the resin substrate to increase the anchor effect. But if the surface of the resin substrate is roughened, the clock frequency used will be decreased and making the copper wires with fine pitches will be difficult. In addition, the oxidative solutions, such as dichromic acid and permanganic acid, are harmful for the human and the earth’s environment. Consequently, a new technology has been studied for increasing the adhesion force between the copper layer and the resin substrate without roughening.
In this study, a chemically adsorbed monolayer (CAM) [1-4] containing pyrrolyl group and the polypyrrole thin film were introduced between the copper layer and the resin substrate for increasing the adhesion force without roughening the resin surface. When the oxidative solutions are used for roughing the surface of the resin substrate in order to increase the anchoring effect, the values of the peel strength force were 0.3～0.6 [N/mm] in our test results. These values sa
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