High strength and high conductivity Cu alloys: A review
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gh strength and high conductivity Cu alloys: A review 1,2
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YANG HuiYa , MA ZiChao , LEI ChenHui , MENG Liang , FANG YouTong , 1,2* 2* LIU JiaBin & WANG HongTao 1
School of Materials Science and Engineering, Zhejiang University, Hangzhou 310027, China; 2 Center for X-Mmechanics, Zhejiang University, Hangzhou 310027, China
Received April 13, 2020; accepted May 9, 2020; published online November 12, 2020
High strength and high conductivity (HSHC) Cu alloys are widely used in many fields, such as high-speed electric railway contact wires and integrated circuit lead frames. Pure Cu is well known to have excellent electrical conductivity but rather low strength. The main concern of HSHC Cu alloys is how to strengthen the alloy efficiently. However, when the Cu alloys are strengthened by a certain method, their electrical conductivity will inevitably decrease to a certain extent. This review introduces the strengthening methods of HSHC Cu alloys. Then the research progress of some typical HSHC Cu alloys such as Cu-Cr-Zr, Cu-Ni-Si, Cu-Ag, Cu-Mg is reviewed according to different alloy systems. Finally, the development trend of HSHC Cu alloys is forecasted. It is pointed out that precipitation and micro-alloying are effective ways to improve the performance of HSHC Cu alloys. At the same time, the production of HSHC Cu alloys also needs to comply with the large-scale, low-cost development trend of industrialization in the future. high strength, high conductivity, Cu alloys Citation:
Yang H Y, Ma Z C, Lei C H, et al. High strength and high conductivity Cu alloys: A review. Sci China Tech Sci, 2020, 63, https://doi.org/10.1007/ s11431-020-1633-8
1 Introduction Cu possesses the highest rating for both the thermal and electrical conductivity of common metals. High conductivity coupled with intrinsic strength, formability and corrosion resistance make Cu alloys unique as conductors of electricity —making them ideal for connectors and other electrical or electronic products [1–3]. For a long time, there is a strengthconductivity trade-off for the research of HSHC Cu materials, which even runs through the entire conductive material research [4,5]. The strengthening methods in HSHC Cu alloys mainly include solid solution strengthening, precipitation strengthening, fine grain strengthening and deformation strengthening. But these strengthening methods will lead to a
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Corresponding authors (email: [email protected]; [email protected])
large number of microscopic defects appear in the crystal, which will decrease the conductivity of the alloys. The way to sacrifice the conductivity of Cu as little as possible under the premise of a substantial increase in Cu strength, that is, to achieve HSHC of Cu, is an important issue. The so-called HSHC Cu alloys, generally refer to the tensile strength 1.5–4 times of pure Cu (300–800 MPa), conductivity 50%–95% of the pure Cu. The ideal index is tensile strength ≥600 MPa, electrical conductivity ≥80% IACS (International Annealed Cu Standard, 100% IACS=1.72 μΩ/cm). Typical exam
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