Investigation of High-Temperature Stability and Thermal Endurance of Silicone Potting Compound by Thermo-Gravimetric Ana
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ORIGINAL PAPER
Investigation of High-Temperature Stability and Thermal Endurance of Silicone Potting Compound by Thermo-Gravimetric Analysis Tanu Srivastava 1,2 & Naresh Kumar Katari 2
&
Balaji Rao Ravuri 2 & K. V. Govindrajan 3 & S. Krishna Mohan 1
Received: 30 July 2020 / Accepted: 18 September 2020 # Springer Nature B.V. 2020
Abstract The high-temperature stability and thermal life of silicone resin-based potting compound (SC-3), used in the aerospace application for electrical insulation, is investigated Thermo-Gravimetry Analysis (TGA) in an inert environment. Nonisothermal TGA is performed in the temperature range of 30 °C to 900 °C at 10, 20, and 30 °C / min heating rates. The kinetic parameters such as activation energy and pre-exponential factor are obtained by the model-free method proposed by Kissinger-Akahira-Sunose (KAS) and Flynn Wall Ozawa (FWO) at various degree of conversion. The thermal degradation of the SC-3 compound is observed in the temperature range of 350 °C to 580 °C, and thermal endurance or time of failure of potting compound SC-3 is estimated as per ASTM E1877 standard. The results reveal that the potting compound SC-3 can be safely used continuously at 100 °C and for ~3.6 min at 350 °C. Experimental results are also useful to understand the degradation mechanism of the SC-3 compound. Keywords Thermo-gravimetric analysis (TGA) . Nonisothermal . Activation energy . Arrhenius equation . Thermal endurance
1 Introduction Potting compounds or Encapsulants are resins or adhesives used to encapsulate circuit boards, semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation, and other specialized characteristics. An encapsulant protects the chips and substrate of high-end electronic products. Encapsulants and potting compounds are based on a variety of chemical systems like polyamide, polyamide-imide (PAI), polybutadiene, polycarbonate (PC), polypropylene (PP), polyurethane (PUR), silicone, * Naresh Kumar Katari [email protected]; [email protected] 1
Defence Research and Development Laboratory, Dr. APJ Abdul Kalam Missile Complex, Kanchanbagh, Hyderabad, Telangana 500058, India
2
School of Science, Gandhi Institute of Technology and Management (GITAM) (Deemed to be University), Hyderabad, Telangana 502329, India
3
BrahMos Aerospace Pvt Ltd., Dr. APJ Abdul Kalam Missile Complex, Kanchanbagh, Hyderabad, Telangana 500058, India
epoxy fluoropolymers, vinyl, and polyvinyl chloride (PVC), etc. [1–3]. Silicone-based compounds are progressively in demand for soft electronics and electrical and electronic device encapsulant and packaging applications. Silicones protect sensitive circuits and devices from heat, contamination, vibrations, and accidental damage and ensure long term performance by providing continuous electrical supply. Additionally, silicone materials are non-corrosive, non-pyrophoric, and meet all electronics’ safety requirements in an aerospace application. Silicones are the on
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