Moisture Sensitivity of Plastic Packages of IC Devices
Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches
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Series Editor E. Suhir University of California, Santa Cruz, CA, USA
For further volumes: http://www.springer.com/series/7493
X.J. Fan · E. Suhir Editors
Moisture Sensitivity of Plastic Packages of IC Devices
Foreword by C.P. Wong
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Editors X.J. Fan Department of Mechanical Engineering Lamar University Beaumont, Texas USA [email protected]
E. Suhir ERS Co. Alvina Court 727 94024 Los Altos, California USA [email protected]
ISBN 978-1-4419-5718-4 e-ISBN 978-1-4419-5719-1 DOI 10.1007/978-1-4419-5719-1 Springer New York Dordrecht Heidelberg London Library of Congress Control Number: 2010927324 © Springer Science+Business Media, LLC 2010 All rights reserved. This work may not be translated or copied in whole or in part without the written permission of the publisher (Springer Science+Business Media, LLC, 233 Spring Street, New York, NY 10013, USA), except for brief excerpts in connection with reviews or scholarly analysis. Use in connection with any form of information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed is forbidden. The use in this publication of trade names, trademarks, service marks, and similar terms, even if they are not identified as such, is not to be taken as an expression of opinion as to whether or not they are subject to proprietary rights. Printed on acid-free paper Springer is part of Springer Science+Business Media (www.springer.com)
Foreword
Moisture, according to the Merriam-Webster dictionary, is defined as “liquid diffused or condensed in relatively small quantity.” It is also defined, by Longman dictionary, as “small amounts of water that are present in the air, in a substance, or on a surface.” Both definitions emphasize on the small quantity, but presumably the state of moisture is in liquid form. In fact, moisture, a small quantity of H2 O molecules, can be in vapor, liquid, or solid phase in air or in any substance. It is interesting to note that moisture sorption is different from water sorption. Moisture sorption process refers to a process in a humid air environment, while water sorption refers to a complete immersion into water. Hydrophobic or superhydrophobic (with water contact angle >150◦ ) materials can effectively prevent water liquid from penetrating through surface, but not for the transmission of moisture (water vapor) in a humid air environment. This interesting phenomenon is illustrated in the first chapter of the book, although the entire book is focused on “moisture” sensitivity of plastic packages of integrated circuit (IC) devices. Most of polymeric materials in IC packaging absorb moisture from an environment. The presence of moisture in plastic materials alters thermal stress through the alteration of thermo-mechanical properties, induces hygroscopic stress through differential swelling, induces vapor pressure that is responsible for the eventual popcorn cracking, reduces interfacial adhesion strength, induces electrical-chemical migration-induced corrosion, and
