Permittivity tunable by Ti 3 SiC 2 ceramics in sandwich-structured polymer composites

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Permittivity tunable by Ti3SiC2 ceramics in sandwichstructured polymer composites Zhuo Wang1,*

, Jiahao Fan1, Xu Guo1, Jiamin Ji1, and Zixiong Sun2

1

Shaanxi Key Laboratory of Green Preparation and Functionalization for Inorganic Materials, School of Materials Science and Engineering, Shaanxi University of Science and Technology, Xi’an 710021, People’s Republic of China 2 School of Electrical Informatica and Artificial Intelligence, Shaanxi University of Science and Technology, Xi’an 710021, People’s Republic of China

Received: 19 April 2020

ABSTRACT

Accepted: 16 September 2020

To further promote the progress of the embedded mold packaging technology in circuit board, polymer-based composites with alternating positive and negative permittivity layer have been designed. Compared with single-layer materials, permittivity in this work is increased from 113 to 250 at 100 Hz in BFT/PVDF– Ti3SiC2/PVDF–BFT/PVDF sandwich structure, with the loss tangent’s decreasing from 0.97 to 0.78. As negative permittivity layer filler, the Ti3SiC2 with optimistic interfacial polarization is ascribed to the flake structure and contributes to improving the permittivity, resulting in good insulation behavior and temperature stability at the same time. It is expected to provide new ideas for investigating high-permittivity polymer–matrix composites in this work.

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Springer Science+Business

Media, LLC, part of Springer Nature 2020

1 Introduction Embedded die packaging has been recognized as the mainstream in modern electronic packaging technology. Capacitors account for more than half of the passive components on the circuit board, so the research of embedded capacitors with excellent performance is necessary for promoting the progress of embedded die packaging [1, 2]. In recent years, polymer materials have received much attention because of their low processing temperature, high breakdown strength, low cost and good compatibility with printed circuit substrates [3–5]. However, the application of all-polymer materials is often limited by their low permittivity. As a result, ceramic–

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https://doi.org/10.1007/s10854-020-04502-4

polymer composites have been regarded as an efficient way for enhancing the dielectric properties. Researchers selected conductive particles or highpermittivity ceramic particles as fillers to compound with polymer matrix, which can improve the permittivity of the material efficiently, but it is difficult to control the dielectric loss within an acceptable range [6–13]. On the basis of balancing the advantages and disadvantages of the existing high-permittivity polymer-based materials, the alternating superimposed structure of positive and negative permittivity layers is adopted in this design. It is hoped that high permittivity and low dielectric loss can be obtained in sandwich polymer matrix composites (SPMCs) with negative permittivity middle layer.

J Mater Sci: Mater Electron

The SPMCs can be equivalent to three capacitors in series. The formul