Production of Copper Powder by Electrodeposition with Different Equilibrium Crystal Shape
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ORIGINAL ARTICLE
Production of Copper Powder by Electrodeposition with Different Equilibrium Crystal Shape Bibhudatta Nanda1 • Manila Mallik1
Received: 17 November 2019 / Accepted: 28 May 2020 Ó The Indian Institute of Metals - IIM 2020
Abstract The copper powder is electrodeposited from copper sulfate pentahydrate (CuSO45H2O) and sulphuric acid (H2SO4) bath. The polarization study is carried out to get an indication of limiting current density or deposition potential. Solutions are prepared with different concentrations of CuSO45H2O, i.e., from 0.015 to 0.35 M. Additives like sodium dodecyl sulfate (SDS) and cetyltrimethylammonium bromide (CTAB) are used during electrodeposition. To elucidate the effect of additive on the copper electrodeposition, an equal concentration of SDS and CTAB is used for a particular concentration of CuSO45H2O. The examination of surface topography is carried out with the help of a scanning electron microscope. In the absence of additive, the morphology is a honeycomb like structure. However, the deposits are dendritic in nature in the presence of the additive. The smallest constituent in the dendrites is different for both the additive added solutions. In the case of CTAB, the smallest constituent is a flower like structure where microspheres of copper are embedded with nanosheets. On the other hand, the faceted crystal appears for SDS added solution. SHAPE V 7.4 software is used to draw the equilibrium crystal shape. In summary, it is concluded that the dissimilarity in the smallest constituent of dendritic morphology is associated with the concentration of the surfactant. Keywords Electrodeposition Equilibrium crystal shape Additive SDS CTAB
& Manila Mallik [email protected] 1
Veer Surendra Sai University of Technology, Burla, Sambalpur, Odisha 768018, India
1 Introduction Plentiful advantages of copper powder are the basis for its synthesis by various methods [1]. Different types of methods like electrodeposition, precipitation, and atomization are used for this purpose. Electrodeposition is one of the versatile and cost-effective methods for the generation of copper powder [1, 2]. Many researchers have synthesized copper powder by the electrodeposition method [3–5]. In electrodeposition, the morphology of the deposits depends on the current density or the overpotential. At lower overpotential or current density, the deposit is smooth and the process is activation controlled. However, at higher overpotential or the limiting current density, the process is diffusion controlled. Powdery deposits can be obtained at higher than the limiting current density or in the plateau region of the limiting current density. The plateau region generally covers a wide range of potential. The dendrites are grown in the plateau, whereas the deposition is associated with hydrogen evolution at the end of the plateau region [3, 6]. Generally, the properties of the powder are affected by the synthesis process. The shape, size, and morphology of the powder decide the properties [7]
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