Strategies for enhancing thermal conductivity of polymer-based thermal interface materials: a review
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Strategies for enhancing thermal conductivity of polymer-based thermal interface materials: a review Haoqi Ma1, Bin Gao1,2, Meiyu Wang1,2, Zhenye Yuan1, Jingbo Shen3, Jingqi Zhao3, and Yakai Feng1,2,4,* 1
School of Chemical Engineering and Technology, Tianjin University, Yaguan Road 135, Tianjin 300350, China Key Laboratory of Systems Bioengineering (Ministry of Education), Tianjin University, Tianjin 300072, China 3 Tianjin Laird Electronic Materials Co., Ltd, Tianjin 300457, China 4 Collaborative Innovation Center of Chemical Science and Chemical Engineering (Tianjin), Weijin Road 92, Tianjin 300072, China 2
Received: 25 July 2020
ABSTRACT
Accepted: 1 September 2020
Thermal management has been considered as a key issue for high-power electronics. Thermal interface materials (TIMs) play an extremely important role in the field of thermal management. Owing to their excellent insulation, mechanical properties and low processing costs, functional polymers have become the popular candidate for preparing TIMs. In order to develop high thermally conductive TIMs, the inorganic fillers with high thermal conductivity are generally composited with polymers. For this purpose, some key technologies are needed to improve the dispersibility of fillers to reduce interfacial thermal resistance and increase thermal conduction channels. This paper reviews recent progresses on effective methods for improving thermal conductivity, which mainly include filler functionalization and processing, filler hybridization and coating, filler orientation and network. After implementing these strategies, the interfacial interaction between fillers and polymers, the synergy effect of different fillers and the thermal conduction pathway inside the matrix can be highly improved, hence enhancing the thermal conductivity of TIMs.
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Springer Science+Business
Media, LLC, part of Springer Nature 2020
Handling Editor: Jaime Grunlan.
Address correspondence to E-mail: [email protected]
https://doi.org/10.1007/s10853-020-05279-x
J Mater Sci
GRAPHIC ABSTRACT
Introduction In recent years, thermal management has been considered as a key issue due to the gradual increase in the power consumption in electronics. Thermal management is usually implemented by removing excessive heat with heat sinks. It is difficult to form perfect contact between electronic chips and heat sinks, which causes lager thermal resistance and reduces thermal diffusivity [1]. To solve this problem, some soft and deformable materials are applied to fill the voids between electronic chips and heat sinks for improving heat transfer, which is known as thermal interface materials (TIMs). Polymers are usually used as the matrix of TIMs due to their excellent insulation, low processing costs and superior mechanical properties [2]. Unluckily, the intrinsic thermal conductivity (TC) of polymers is very low (less than 0.5 W m-1 K-1), which cannot meet the requirement of high TC of TIMs. The inorganic fillers with high TC are broadly composited with polymer matrixes to improve thei
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