Three-dimensional topology optimization of thermal-fluid-structural problems for cooling system design
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RESEARCH PAPER
Three-dimensional topology optimization of thermal-fluid-structural problems for cooling system design Minghao Yu 1 & Shilun Ruan 1 & Junfeng Gu 1 & Mengke Ren 1 & Zheng Li 1
&
Xinyu Wang 2 & Changyu Shen 1
Received: 20 November 2019 / Revised: 14 August 2020 / Accepted: 24 August 2020 # Springer-Verlag GmbH Germany, part of Springer Nature 2020
Abstract In the present study, a topology optimization method of thermal-fluid-structural problems is researched to design the three-dimensional heat sink with load-carrying capability. The optimization is formulated as a mean temperature minimization problem controlled by Navier-Stokes (N-S) equations as well as energy balance and linear elasticity equations. In order to prevent an unrealistic and low loadcarrying design, the power dissipation of the fluid device and the normal displacement on the load-carrying surface are taken as constraints. A parallel solver of multi-physics topology optimization problems is built-in Open Field Operation And Manipulation (OpenFOAM) software. The continuous adjoint method is adopted for the sensitivity analysis to make the best use of built-in solvers. With the developed tool, the three-dimensional (3D) thermal-fluid topology optimization is studied. It is found that the Darcy number, which is suitable for fluid design, may cause severe problems in thermal-fluid optimization. The structural features of 3D thermal-fluidstructural problems are also investigated. The “2D extruded designs” are helpful to improve the structural stiffness, and channels with a larger aspect ratio in high-temperature areas improve the cooling performance. Keywords Topology optimization . Thermal-fluid-structural optimization problem . Continuous adjoint method . Parallel computing . OpenFOAM
1 Introduction Cooling systems are widely used in engineering products and processes, such as batteries, chips, and injection molding. With the development of manufacturing technology, the liquidcooled heat sink holds great potential as a robust and effective cooling device for removing high heat flux. However, the
Responsible Editor: YoonYoung Kim Electronic supplementary material The online version of this article (https://doi.org/10.1007/s00158-020-02731-z) contains supplementary material, which is available to authorized users. * Zheng Li [email protected] 1
State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, and International Research Center for Computational Mechanics, Dalian University of Technology, Dalian, China
2
The William G. Lowrie Department of Chemical and Biomolecular Engineering, The Ohio State University, Columbus, OH, USA
inappropriate design of cooling channels may reduce the efficiency of the systems and increase the probability of product failure. Some researchers (Au et al. 2011; Li 2001; Park and Pham 2009; Xu et al. 2010; Yu et al. 2011) applied the heuristic method to design high-performance heat sink. The optimization process is very efficient because no simulation
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