Recrystallization and Grain Growth of 316L Stainless Steel Wires
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NTRODUCTION
HEAVILY cold-drawn 316L stainless steel wire has great practical importance due to its excellent properties in electronic conductivity, high yield strength, corrosion resistance, softness, flexibility, and abrasion resistance, and its ability to serve at temperatures as high as 923 K (650 °C).[1,2] It has been widely used in textile products such as electrodes for medical applications, electrical conductive material for smart electronic elements, filters for chemical and high-temperature environments, and conveyor belts for glass industries.[35] The properties of 316L stainless steel wire are governed primarily by the chemical composition, microstructure, and drawing process of the wire. Among the preceding factors, grain size has been demonstrated to play an important role in the mechanical properties of most polycrystalline materials. Much work has already been done on the grain growth behavior of polycrystalline materials at elevated temperatures.[6,7] Many attempts have been made to model recrystallization and grain growth of steels by using various models such as the Potts (Monte Carlo) model,[8] Johnson–Mehl–Avrami–Kohnogorov (JMAK) model,[9] Avrami model,[10] and Arrhenius model.[11] As to austenitic stainless steels, several studies have been reported on the effect of grain size on XIUYUN ZHAO and PING FENG, Masters, and YONG LIU, Professor, are with the State Key Laboratory Powder Metallurgy, School of Powder Metallurgy Research Institute, Central South University, Lu Shan Road No 932, Yuelu District, Changsha 410000 Hunan, P.R. China. YAN WANG, Postdoctor, is with the School of Aeronautics and Astronautics, Central South University, Changsha 410083, P.R. China. Contact e-mail: [email protected] HUIPING TANG, Professor, is with the State Key Laboratory of Porous Metals Materials, Northwest Institute for Non-ferrous Metal Research, Wei Yang Road No 96, Xi’an 710016 Shaanxi, P.R. China. Manuscript submitted December 25, 2013. Article published online April 19, 2014 3446—VOLUME 45A, JULY 2014
their mechanical properties and grain growth behavior.[1215] However, little information[16,17] can be obtained about the recrystallization and the grain growth behaviors of austenitic stainless steel wires. The driving force for grain growth in both bulk and thin film materials is the reduction of grain boundary energy, which results from the reduction of the total grain boundary area. Almansto¨tter and Ru¨hle[18] investigated the grain growth phenomena of tungsten wire with a diameter of 500 lm. A low value of grain growth exponent n was explained by the fact that the impurities restrained the grain boundary motion. Cho et al.[19] discussed the recrystallization and the grain growth of copper and gold bonding wires. It was found that both copper and gold bonding wires had typical textures consisting of h111i and h100i components, which remained during recrystallization and the grain growth processes. Thus, the grain growth behaviors of wire materials are more complex than those of bulk materials. In this wor
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