Semi-solid Processing of Alloys
This book presents the state of the art concerning the fundamental aspects of semi-solid processing of alloys and composites, together with the industrial applications. The fundamental aspects include both the microstructure development and characterizati
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Semi-solid Processing of Alloys
123
Springer Series in
materials science
124
Springer Series in
materials science Editors: R. Hull
R. M. Osgood, Jr.
J. Parisi
H. Warlimont
The Springer Series in Materials Science covers the complete spectrum of materials physics, including fundamental principles, physical properties, materials theory and design. Recognizing the increasing importance of materials science in future device technologies, the book titles in this series ref lect the state-of-the-art in understanding and controlling the structure and properties of all important classes of materials.
Please view available titles in Springer Series in Materials Science on series homepage http://www.springer.com/series/856
David H. Kirkwood Michel Su´ery Plato Kapranos Helen V. Atkinson Kenneth P. Young
Semi-solid Processing of Alloys With 103 Figures
123
Dr. David H. Kirkwood Dr. Plato Kapranos University of Sheffield Department of Engineering Materials Mappin Street, Sheffield S1 3JD, UK E-mail: d.h.kirkwood@sheffield.ac.uk p.kapranos@sheffield.ac.uk
Professor Helen V. Atkinson University of Leicester, Department of Engineering University Road, LE2 3TJ Leicester, UK E-mail: [email protected]
Dr. Michel Su´ery Grenoble INP Laboratorie SIMAP Groupe GPM2 BP 46, 38402 St.-Martin d’H`eres, France E-mail: [email protected]
Dr. Kenneth P. Young Vforge Inc. 5567 West 6th Ave, Lakewood, CO 80214, USA E-mail: [email protected]
Series Editors:
Professor Robert Hull
Professor Jürgen Parisi
University of Virginia Dept. of Materials Science and Engineering Thornton Hall Charlottesville, VA 22903-2442, USA
Universit¨at Oldenburg, Fachbereich Physik Abt. Energie- und Halbleiterforschung Carl-von-Ossietzky-Straße 9–11 26129 Oldenburg, Germany
Professor R. M. Osgood, Jr.
Professor Hans Warlimont
Microelectronics Science Laboratory Department of Electrical Engineering Columbia University Seeley W. Mudd Building New York, NY 10027, USA
DSL Dresden Material-Innovation GmbH Pirnaer Landstr. 176 01257 Dresden, Germany
Springer Series in Materials Science ISSN 0933-033X ISBN 978-3-642-00705-7 e-ISBN 978-3-642-00706-4 DOI 10.1007/978-3-642-00706-4 Springer Heidelberg Dordrecht London New York Library of Congress Control Number: 2009929024 © Springer-Verlag Berlin Heidelberg 2010 This work is subject to copyright. All rights are reserved, whether the whole or part of the material is concerned, specif ically the rights of translation, reprinting, reuse of illustrations, recitation, broadcasting, reproduction on microf ilm or in any other way, and storage in data banks. Duplication of this publication or parts thereof is permitted only under the provisions of the German Copyright Law of September 9, 1965, in its current version, and permission for use must always be obtained from Springer-Verlag. Violations are liable to prosecution under the German Copyright Law. The use of general descriptive names, registered names, trademarks, etc. in this publication does not imply, even in the absence of a specif
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