Silver Metallization Stability and Reliability
Silver has the lowest resistivity of all metals, which makes it an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address
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Series Editor Professor Brian Derby, Professor of Materials Science Manchester Materials Science Centre, Grosvenor Street, Manchester, M1 7HS, UK Other titles published in this series Fusion Bonding of Polymer Composites C. Ageorges and L. Ye Composite Materials D.D.L. Chung Titanium G. Lütjering and J.C. Williams Corrosion of Metals H. Kaesche Corrosion and Protection E. Bardal Intelligent Macromolecules for Smart Devices L. Dai Microstructure of Steels and Cast Irons M. Durand-Charre Phase Diagrams and Heterogeneous Equilibria B. Predel, M. Hoch and M. Pool Computational Mechanics of Composite Materials M. Kamiński Gallium Nitride Processing for Electronics, Sensors and Spintronics S.J. Pearton, C.R. Abernathy and F. Ren Materials for Information Technology E. Zschech, C. Whelan and T. Mikolajick Fuel Cell Technology N. Sammes Casting: An Analytical Approach A. Reikher and M.R. Barkhudarov Computational Quantum Mechanics for Materials Engineers L. Vitos Modelling of Powder Die Compaction P.R. Brewin, O. Coube, P. Doremus and J.H. Tweed
Daniel Adams • Terry L. Alford and James W. Mayer
Silver Metallization Stability and Reliability
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Daniel Adams, PhD Department of Physics University of the Western Cape 7535 Bellville South Africa
Terry L. Alford, PhD School of Materials Science Arizona State University Tempe, Arizona 85287-6006 USA
James W. Mayer, PhD School of Materials Science Arizona State University Tempe, Arizona 85287-6006 USA
ISBN 978-1-84800-026-1
e-ISBN 978-1-84800-027-8
Engineering Materials and Processes ISSN 1619-0181 British Library Cataloguing in Publication Data Adams, Daniel Silver metallization : stability and reliability. (Engineering materials and processes) 1. Silver - Electrometallurgy 2. Electrochemical metallizing 3. Integrated circuits - Materials I. Title II. Alford, Terry L. III. Mayer, James W., 1930669.2'3 ISBN-13: 9781848000261 Library of Congress Control Number: 2007932625 © 2008 Springer-Verlag London Limited Apart from any fair dealing for the purposes of research or private study, or criticism or review, as permitted under the Copyright, Designs and Patents Act 1988, this publication may only be reproduced, stored or transmitted, in any form or by any means, with the prior permission in writing of the publishers, or in the case of reprographic reproduction in accordance with the terms of licences issued by the Copyright Licensing Agency. Enquiries concerning reproduction outside those terms should be sent to the publishers. The use of registered names, trademarks, etc. in this publication does not imply, even in the absence of a specific statement, that such names are exempt from the relevant laws and regulations and therefore free for general use. The publisher makes no representation, express or implied, with regard to the accuracy of the information contained in this book and cannot accept any legal responsibility or liability for any errors or omissions that may be made. Printed on acid-free paper 9 8 7 6 5 4 3 2 1 springer.com
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