Synthesis and characterization of air-stable Cu nanoparticles for conductive pattern drawing directly on paper substrate
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RESEARCH PAPER
Synthesis and characterization of air-stable Cu nanoparticles for conductive pattern drawing directly on paper substrates Wei Li • Minfang Chen • Jun Wei • Wenjiang Li Chen You
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Received: 30 May 2013 / Accepted: 16 August 2013 / Published online: 22 November 2013 Ó Springer Science+Business Media Dordrecht 2013
Abstract Air-stable Cu nanoparticles (NPs) with an average diameter of 6.5 nm were synthesized under ambient conditions using polyvinylpyrrolidone and cetyltrimethylammonium bromide as a mixed capping agent, for preparing nano-Cu ink applicable for direct writing on photo paper using a roller pen. The size, morphology, and air-stability of the Cu NPs were characterized by TEM, SEM, XRD, etc. The mixed capping agent was effective in reducing the aggregation, size of the Cu NPs and improving their airstability. The reduced size and enhanced air-stability of the Cu NPs resulted in an improved particle density upon sintering, which was mainly responsible for the increased conductivity of the Cu patterns. The resistivity of Cu patterns sintered at 160 °C for 2 h was 11 ± 0.8 lX cm, 6.40 times the bulk resistivity. A sample RFID antenna and a decorative logo were successfully made and the Cu patterns or lines exhibited excellent integrity and good conductivity, which were experimentally tested. W. Li School of Materials Science and Engineering, Tianjin University, Tianjin 300072, China M. Chen J. Wei W. Li C. You School of Materials Science and Engineering, Tianjin University of Technology, Tianjin 300384, China M. Chen (&) Tianjin Key Lab for Photoelectric Materials & Devices, Tianjin University of Technology, Tianjin 300384, China e-mail: [email protected]
Keywords Copper nanoparticles Air-stable Conductive ink Sintering Conductive pattern
Introduction The fabrication of conductive patterns as electric circuits is essential in the manufacture of flexible printed devices in various applications such as displays, antennas, solar cells, transistors, etc. (Chen et al. 2003; Michael et al. 2009; Otte et al. 2006; Okimoto et al. 2010). Traditional photolithography technology for producing precise thin lines in the microfabrication of conductive patterns in electronics, including etching and electroplating, is complicated and expensive and new manufacturing techniques such as inkjet printing (Singh et al. 2010), sputter coating (Siegel et al. 2009), and airbrush spraying (Siegel et al. 2010) have been developed in recent years. However, these new techniques usually require expensive equipment and generate some pollution and wastes. In this regard, a convenient and low-cost penon-paper approach, in which conductive patterns can be directly written on a paper substrate using a roller pen filled with conductive ink, is considered as a promising alternative technology (Russo et al. 2011; Tai and Yang 2011). Noble metals such as gold and silver nanoparticles (NPs) are currently used as conductive ink materials (Samarasinghe et al. 2006; Jensen et al. 2011; Zhang
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