The characteristics of joints with Indium-silver alloy using diffusion soldering method
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The characteristics of joints with Indium-silver alloy using diffusion soldering method Je Yoon Kim1, Sang Won Park1, Jee Young Yoon1, Hwa Young Kim1, Dae Yeon Lee1, Gyu Tae Kim1, Man Young Sung1,*, and Ey Goo Kang2 1
Dep. of Electrical Engineering, Korea Univ, Anam-dong, Sungbuk-ku, Seoul , Korea Dep. of Electronic Engineering, Far East Univ, Gamgok-Myun, Chung-buk , Korea * Email : [email protected] 2
Abstract Bonding process using indium-silver alloy which can withstand high temperature was investigated at relatively low temperature. We used a thermal evaporator and vacuum coater for making indium-silver contact. From the result of experiment, we observed that indium and silver films which have good quality are formed. From phase diagram of In-Ag alloy, we can find that melting point of these compounds increases with the silver content, i.e. eutectic (144℃)
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