Thermal and hydraulic performance analysis of a heat sink with corrugated channels and nanofluids
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Thermal and hydraulic performance analysis of a heat sink with corrugated channels and nanofluids Benyamin Naranjani1 · Ehsan Roohi2,3 · Amin Ebrahimi4 Received: 28 November 2019 / Accepted: 2 September 2020 © The Author(s) 2020
Abstract Cooling of electronic devices is one of the critical challenges that the electronics industry is facing towards sustainable development. Aiming at lowering the surface temperature of the heat sink to limit thermally induced deformations, corrugated channels and nanofluids are employed to improve the thermal and hydraulic performances of a heat sink. Three-dimensional simulations based on the finite-volume approach are carried out to study conjugated heat transfer in the heat sink. Waterbased nanofluids containing Al2 O3 nanoparticles with two different particle sizes (29 nm and 40 nm) and volume fractions less than 4% are employed as the coolant, and their influence on the thermal and hydraulic performance of the heat sink is compared with the base fluid (i.e. water). An empirical model is utilised to approximate the effective transport properties of the nanofluids. Employing corrugated channels instead of straight channels in the heat sink results in an enhancement of 24–36% in the heat transfer performance at the cost of 20–31% increase in the required pumping power leading to an enhancement of 16–24% in the overall performance of the heat sink. Additionally, the numerical predictions indicate that the overall performance of the proposed heat sink design with corrugated channels and water–Al2 O3 nanofluids is 22–40% higher than that of the water-cooled heat sink with straight channels. It is demonstrated that the overall performance of the heat sink cooled with water–Al2 O3 nanofluids increases with reducing the average nanoparticle size. Additionally, the maximum temperature rise in the heat sinks is determined for different thermal loads. Keywords Heat sink · Thermal performance · Energy efficiency · Laminar forced convection · Nanofluid · Electronic cooling
Introduction
* Amin Ebrahimi [email protected] 1
Department of Civil Engineering and Mechanics, University of Wisconsin-Milwaukee, Milwaukee, WI 53201, USA
2
Department of Mechanical Engineering, Faculty of Engineering, Ferdowsi University of Mashhad, P.O. Box 91775‑1111, Mashhad, Khorasan Razavi, Iran
3
State Key Laboratory for Strength and Vibration of Mechanical Structures, International Center for Applied Mechanics (ICAM), School of Aerospace Engineering, Xi’an Jiaotong University (XJTU), Xi’an, China
4
Department of Materials Science and Engineering, Delft University of Technology, Mekelweg 2, 2628CD Delft, The Netherlands
Devising effective cooling systems is crucial to make an advancement in electronic packaging technology and to support the sustainable development of modern devices. Progressive enhancement of the performance, reliability and miniaturisation of devices emerges thermal challenges and requires highly effective heat removal equipment [1]. Employing single-phase microchannel
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