Thermal Processing of Packaged Foods
This new edition discusses the physical and engineering aspects of the thermal processing of packaged foods and examines the methods which have been used to establish the time and temperature of processes suitable to achieve adequate sterilization or past
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S. Donald Holdsworth Ricardo Simpson
Thermal Processing of Packaged Foods Third Edition
Food Engineering Series Series Editor Gustavo V. Barbosa-Ca´novas, Washington State University, USA
Advisory Board Jose´ Miguel Aguilera, Catholic University, Chile Kezban Cando gan, Ankara University, Turkey Richard W. Hartel, University of Wisconsin, USA Albert Ibarz, University of Lleida, Spain Jozef Kokini, Purdue University, USA Michael McCarthy, University of California, USA Keshavan Niranjan, University of Reading, United Kingdom Micha Peleg, University of Massachusetts, USA Shafiur Rahman, Sultan Qaboos University, Oman M. Anandha Rao, Cornell University, USA Yrj€ o Roos, University College Cork, Ireland Jorge Welti-Chanes, Monterrey Institute of Technology, Mexico
Springer’s Food Engineering Series is essential to the Food Engineering profession, providing exceptional texts in areas that are necessary for the understanding and development of this constantly evolving discipline. The titles are primarily reference-oriented, targeted to a wide audience including food, mechanical, chemical, and electrical engineers, as well as food scientists and technologists working in the food industry, academia, regulatory industry, or in the design of food manufacturing plants or specialized equipment.
More information about this series at http://www.springer.com/series/5996
S. Donald Holdsworth • Ricardo Simpson
Thermal Processing of Packaged Foods Third Edition With a contribution by: Dr. Cristian Ramirez Associate Researcher Universidad Te´cnica Federico Santa Marı´a Chile
S. Donald Holdsworth Stretton-on-Fosse Gloucestershire, UK
Ricardo Simpson Universidad Te´cnica Federico Santa Marı´a Valparaı´so, Chile
ISSN 1571-0297 Food Engineering Series ISBN 978-3-319-24902-5 ISBN 978-3-319-24904-9 DOI 10.1007/978-3-319-24904-9
(eBook)
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