Three-Dimensional Electronic Surfaces
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Three-Dimensional Electronic Surfaces J.C. Sturm, P.I. Hsu, S.M. Miller, H. Gleskova, A. Darhuber, M. Huang, S. Wagner, S. Troian, and Z. Suo Center for Photonics and Optoelectronic Materials (POEM), Princeton University, Princeton, NJ 08544 USA 609-258-5610, 609-258-1954, [email protected]
Abstract There is an increasing interest in electronics functionality on surfaces which are not planar. This paper examines the critical technologies for fabricating electronic surfaces which have a three-dimensional shape. Two different approaches for achieving such a goal are examined. One can fabricate electronics using conventional technologies on a flat surface, and then after fabrication deform that surface into the desired shape (e.g. a spherical cap). In an alternative approach, one can directly fabricate onto substrates with an arbitrary shape. In this case one must address the issue of pattern formation and transfer on the curved surfaces. The scaling of letterpress printing to micron-scale features on flat and spherically curved surfaces is demonstrated. Introduction Electronic and optoelectronic products are conventionally flat because of their fabrication on the surface of a semiconductor wafer or glass. However, there are several drivers for curved products. A straightforward example would be a flat panel display which could be rolled up. A more complex example might be an artificial "sensitive skin" which could be worn over a robot surface for collision avoidance or on a person as a medical monitoring device. Finally, for focal plane array imagers with large fields of view, the optics to provide a spherically curved focal plane (as opposed to a conventional focal plane) are far smaller, translating into a smaller, lighter, and lower cost system. Thus one wants a similarly curved detector array. This paper will specifically address the fabrication of a product which might have a complex surface shape, but would not have to change shape during use. In making such a surface in three dimensions which has electronic capability, one could consider making it first on a flat substrate (such as a metal or plastic foil) and subsequently deforming the processed substrate to the final shape. This approach has the benefit of relatively straightforward device fabrication on a planar surface, but the deformation could damage the fabricated components or interconnects. The first part of this paper explores the limits of this approach. The second part of the paper examines a printing technology which might be applied to define patterns directly on curved surfaces of arbitrary shape. With such a technology one could then consider device fabrication directly on the curved surface. The scaling of letterpress printing on planar and curved surfaces is examined.
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Deformation of Prefabricated Planar Substrates Spherical Deformation As a model system, we considered the deformation of prefabricated substrates into the shape of a spherical cap. Both stainless steel foil and polyimide foil substrates were examined. The deforma
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