Three-dimensional lithography by elasto-capillary engineering of filamentary materials
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roduction Rapid developments in microelectronic devices and miniaturized sensors rely on defining small patterns at everdecreasing length scales, which are now reaching sub-22 nm.1 The required level of precision and complexity can be achieved using ultraviolet lithography to define deterministic pattern geometries and sequential metal/ceramic/ semiconductor deposition and etching. However, these techniques are cost-efficient only up to wafer-scale sizes (
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