3D Stacked Chips From Emerging Processes to Heterogeneous Systems
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of t
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Stacked Chips From Emerging Processes to Heterogeneous Systems
3D Stacked Chips
Ibrahim (Abe) M. Elfadel • Gerhard Fettweis Editors
3D Stacked Chips From Emerging Processes to Heterogeneous Systems
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Editors Ibrahim (Abe) M. Elfadel Masdar Institute of Science and Technology Abu Dhabi, United Arab Emirates
Gerhard Fettweis Vodafone Chair Mobile Communication Dresden, Germany
ISBN 978-3-319-20480-2 ISBN 978-3-319-20481-9 (eBook) DOI 10.1007/978-3-319-20481-9 Library of Congress Control Number: 2016930408 © Springer International Publishing Switzerland 2016 This work is subject to copyright. All rights are reserved by the Publisher, whether the whole or part of the material is concerned, specifically the rights of translation, reprinting, reuse of illustrations, recitation, broadcasting, reproduction on microfilms or in any other physical way, and transmission or information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed. The use of general descriptive names, registered names, trademarks, service marks, etc. in this publication does not imply, even in the absence of a specific statement, that such names are exempt from the relevant protective laws and regulations and therefore free for general use. The publisher, the authors and the editors are safe to assume that the advice and information in this book are believed to be true and accurate at the date of publication. Neither the publisher nor the authors or the editors give a warranty, express or implied, with respect to the material contained herein or for any errors or omissions that may have been made. Printed on acid-free paper This Springer imprint is published by Springer Nature The registered company is Springer International Publishing AG Switzerland
To Our Beloved Families
YOU, WHO are blessed with shade as well as light, you, who are gifted with two eyes, endowed with a knowledge of perspective, and charmed with the enjoyment of various colours, you, who can actually see an angle, and contemplate the complete circumference of a Circle in the happy region of the Three Dimensions—how shall I make clear to you the extreme difficulty which we in Flatland experience in recognizing one another’s configuration? Edwin A. Abott, Flatland
Foreword
The research work described in this timely book is the fruit of a deep and successful partnership between Dresden and Abu Dhabi. When this work started in 2012, Dresden, capital of the Free State of Saxony, Germany, was already a global R&D hub of the semiconductor industry. Abu Dhabi, capital of the UAE, was making its first steps on the way to becoming a major R&D hub of the global semiconductor industry. The theme of 3D-integrated circuits was chosen as the subject of collaboration between the two academic partners, Technical University of Dresden and the Masdar Institute of Science and Technology in Abu Dhabi, because of its potential and promise amongst the plethora of more-than-Moore technologies. It is hearteni
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