A Novel High Aspect Ratio Technology for MEMS Fabrication Using Standard Silicon Wafers
A novel CMOS-compatible technology for the fabrication of MEMS based on standard single crystal silicon wafers is available at the Center of Microtechnologies [1]. High Aspect Ratio Microstructures (HARMs) are manufactured using a three mask level technol
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Engineering
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Jiirgen Valldorf • Wolfgang Gessner (Eds.)
Advanced Microsystems for Automotive Applications 2003
With 357 Figures
Springer
Dr. Jiirgen Valldorf VDI/VDE-Technologiezentrum Informationstechnik GmbH Rheinstr. lOB D-14513 Teltow e-mail: [email protected] Dr. Wolfgang Gessner VDI/VDE-Technologiezentrum Informationstechnik GmbH Rheinstr. lOB D-14513 Teltow e-mail: [email protected]
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Preface Microsystems have become an indispensable constituent of modern automobiles. Many features of the vehicle requested by today’s customers can only be offered by applying intelligent and extremely miniaturised components. Improvements in comfort, safety, engine performance and emissions are unimaginable without microsystems and their underlying technologies. Still there remain a series of obstacles to overcome and challenges to face: costeffectiveness of microsystems and in this context manufacturing, resistance against environmental parameters such as humidity, temperature, reliability and – may be the most exigent – systems integration. The latter implies the integration of microsystems into new electronic architecture concepts as well as issues related to a possible centralisation and combination of functions. Present and future development strategies related to microsystems for automobiles have to take into account the communication of the vehicle with an intelligent external environment. The Yearbook 2003 “Advanced Microsyst