A semi-empirical model for thermal conductivity of polymer nanocomposites containing carbon nanotubes
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A semi‑empirical model for thermal conductivity of polymer nanocomposites containing carbon nanotubes M. Safi1 · M. K. Hassanzadeh‑Aghdam1 · M. J. Mahmoodi1 Received: 30 March 2019 / Revised: 28 July 2019 / Accepted: 18 December 2019 © Springer-Verlag GmbH Germany, part of Springer Nature 2020
Abstract A new version of the semi-empirical Halpin–Tsai (H–T) model is presented to evaluate the effective thermal conductivity of general carbon nanotubes (CNTs)reinforced polymer nanocomposites. The model captures the influences of the CNTs alignment, random orientation, aggregation, waviness, length, diameter and the CNT/polymer interfacial thermal resistance parameters. In order to verify the suitability of the new H–T model, the numerically calculated thermal conductivities are compared with existing experimentally measured ones. An excellent predictability is found of the modified H–T model over a wide range of the tests. The consideration of the CNT waviness and the interfacial thermal resistance parameters is seriously essential for a more realistic prediction in all conditions. For aligned CNTreinforced polymer nanocomposites, considering the alignment factor seems to be very important. Moreover, in the case of well-dispersed CNTs into the matrix, it is necessary to incorporate the CNT random orientation parameter. Additionally, when CNTs are not well dispersed, the CNT aggregation and random orientation parameters must be incorporated in the analysis. The effects of the CNT volume fraction, length, diameter and non-straight shape on the nanocomposite thermal conducting behavior are estimated in details. The results clearly expose that it is needed to eliminate the aggregation, use the straight CNTs and form a strong interface if the full potential of CNT reinforcement is to be realized. Finally, the thermal conductivities of CNT-shape-memory polymer nanocomposites at different temperatures are obtained. Keywords Nanocomposite · Carbon nanotube · Thermal conductivity · Halpin–Tsai model · Aggregation
* M. Safi [email protected] * M. J. Mahmoodi [email protected] 1
Faculty of Civil, Water and Environmental Engineering, Shahid Beheshti University, Tehran, Iran
13
Vol.:(0123456789)
Polymer Bulletin
Introduction In recent years, there has been a rapid growth in the use of polymer matrix composites (PMCs) as structural components in aerospace, energy harvesting and automobile industries due to their high adhesion, low weight and good chemical resistance [1–3]. New composite materials with a relatively high thermal conductivity are needed due to the applications of polymers as heat sinks in electronic packaging. Moreover, in some engineering structures, a high thermal conductivity can be suitable because of decreasing the temperature gradient and therefore, the thermally induced stresses arise from the manufacturing process [4]. In general, the improved thermal conductivity in polymers can be obtained by the addition of conductive fillers [5]. The use of carbon nanotube (CNT) as the filler in polymer mat
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