a-Si TFT OLED Fabricated on Low-Temperature Flexible Plastic Substrate
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a-Si TFT OLED Fabricated on Low-Temperature Flexible Plastic Substrate Kalluri R. Sarma Honeywell International, 21111 N. 19th Avenue, Phoenix, AZ 85027, USA Tel. 602-436-6415; Fax: 602-436-2821; e-mail: [email protected]
ABSTRACT Active matrix organic light emitting diode (AM OLED) display fabricated on a flexible plastic substrates has a potential for being lower cost, lighter weight, lower power and highly rugged with superior image quality, compared to the current glass substrate based AM LCDs. Amorphous silicon (a-Si) technology offers the potential for fabricating the required active matrix backplanes on low temperature (< 150oC) plastic substrates for producing flexible AM OLED displays. We have developed low-temperature a-Si TFT processes, and backplane electronics designs to fabricate and successfully demonstrate AM OLEDs using 4”-size flexible plastic substrates. Flexible AM OLED test displays with sizes up to 2x2-inch and resolutions up to 80 cgpi equivalent have been designed and fabricated. The required enabling technologies and fabrication and evaluation of these displays are discussed.
INTRODUCTION Recently there has been much interest in the development of flexible displays for the commercial and military applications as can be evidenced from the papers in this conference. Flexible display development is also benefiting from the developmental efforts in large area macroelectronics aimed at applications other than displays and vice versa. AM OLED (Active matrix organic light emitting diode display) technology offers a significant potential for realizing rugged, full color, lightweight, low power and low cost flexible displays. AM OLED technology based on rigid glass substrates is advancing rapidly. Small size (~ 2–inch diagonal) displays are already being used in mobile phones and digital cameras. Feasibility of large size (> 15-inch diagonal) AM OLED displays has already demonstrated for the PC and TV type applications [12]. While the development of flexible AM-OLED display technology may be viewed as a natural evolution of the rigid glass substrate based AM-OLEDs, in actuality, flexible AM OLED development represents a paradigm shift. Flexible AM OLED displays can enable many unique display applications, due to their inherent ruggedness, and unique form factors of conformability and rollability during use, transportation and storage. Further, flexible displays are believed to be amenable roll-to-roll manufacturing for significant manufacturing cost reduction. Several enabling technologies must be developed to realize flexible AM OLED displays. The enabling technologies include: a) development of the flexible substrates with the required characteristics and the associated substrate processes, b) development of the TFT (thin film transistor) backplane, and display drive electronics designs and processes compatible with the selected flexible substrate, and c) thin film encapsulation / barrier layers for the protection of the
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OLED devices from oxygen and moisture in the
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