A wafer-level package of wideband microwave transmission system based on BCB/metal structure embedded in Si substrate
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TECHNICAL PAPER
A wafer-level package of wideband microwave transmission system based on BCB/metal structure embedded in Si substrate Tianxi Wang • Jiajie Tang • Le Luo
Received: 24 September 2012 / Accepted: 2 March 2013 Ó Springer-Verlag Berlin Heidelberg 2013
Abstract In this paper, a wafer-level package for a microwave transmission system has been implemented and tested. Three monolithic microwave integrated circuits packaged in one microwave system are first proposed. The packaged system consists of an up-converter, a drive amplifier and a power amplifier. All the modules are embedded in the cavities pre-etched in a low-resistivity silicon substrate. Benzocyclobutene layers are coated on the components and silicon substrate, serving as interlayer dielectrics. Gold bumps are used as electric interconnections between different layers. Gold micro-strip lines are employed as transmission lines. The electrical properties of the packaging structure are investigated. The design procedure is proposed and the simulation regarding transmission line has been done. The thermal property of the packaged system is simulated and detailed discussion is presented. The measured transmission characteristics of the packaged system shows that the modules can work at very wide band, at the range of 6–18 GHz (X/Ku band) and its gain agrees well with the theoretical results.
T. Wang J. Tang L. Luo (&) Science and Technology on Micro-system Laboratory, State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, 865 Changning Road, Shanghai 200050, China e-mail: [email protected] T. Wang e-mail: [email protected] T. Wang J. Tang Graduate School of the Chinese Academy of Sciences, Beijing 100049, China
1 Introduction With the rapid development of the information age, extensive use of MMICs and T/R (Transmit/Receive) modules in communications are demanding towards high power, high operation frequency, high reliability, low weight, low cost and small size. It promotes the packaging technology to meet the requirements for higher thermal conductivity, smaller size, lower transmission loss, lower parasitics and lower crosstalk between different modules. A multilayer organics based wafer level microwave multichip modules (MMCM) packaging method is one of the good candidates to meet such demands. In microwave system packaging, different types of planar transmission lines as well as passive components, e.g. inductors and RF-MEMS switches have been studied intensively (Carrillo-Ramirez and Jackson 2003; Carchon et al. 2004; Ju et al. 2001; Tang et al. 2012; Tilmans et al. 2003), and some work has been reported on the package with the structure of MMIC embedded in a silicon substrate (Geng et al. 2009). As a prominent issue in layout, the crosstalk between the micro-strip lines has been discussed (Papapolymerou et al. 2004; Ponchak et al. 2005). These studies are only based on an individual transmission module. The system level MMCM package, coupled wit
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