Integral Substrate Package Technology
Integral substrate package technology has been in existence for many years, although it is rarely used in large-scale hybrid circuit production. It offers the hybrid circuit manufacturer a method for producing high reliability, hermetically sealed circuit
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IFS
THE ELECTRONICS ASSEMBLY HANDBOOK
Edited by Frank Riley and The Staff of Electronic Packaging and Production
Springer-Verlag Berlin Heidelberg GmbH
Frank Riley The Bodine Corporation PO Box3245 317 Mountain Grove Street Bridgeport, CT06605 USA
Electronic Packaging & Production Cahners Publishing Company, A Division of Reed Publishing (USA) lnc. 1350E. Touhy Avenue P0Box5080 Des Plaines, IL 60017-5080 USA
British Library Cataloguing in Publicati ou Data The Electronics Assembly Handbook
1. Electronic apparatus and appliancesAssembly II. Electronic Packaging & Production I. Riley, Frank TK7870 621.3815'1 ISBN 978-3-662-13161-9 (eBook) ISBN 978-3-662-13163-3 DOI 10.1007/978-3-662-13161-9
© 1988 Springer-Verlag Berlin Heidelberg
Originally published by Springer-Verlag Berlin Heidelberg New York London Paris Tokyo in 1988 This work is protected by copyright. The rights covered by this are reserved, in particular those of translating, reprinting, radio broadcasting, reproduction by photo-mechanical or similar means as well as the storage and cvaluation in data processing installations even if only extracts are used. Should individual copics for commercial purposes be made with written consent of the publisher then a remittance shall be given to the publisher in accordance with §54, Para 2, of the copyright law. The publisher will provide information on the amount of this remittance. Phototypeset by Wagstaffs Typcshuttle, Hcnlow, Bedfordshire
Acknowledgeme nts The maJonty of the articles comprising this work originally appeared in Electronic Packaging and Production, a monthly publication of Cahners Publishing Company, USA. IFS Publications would like to express its thanks to Cahners Publishing for allowing these articles to be used and for its assistance in the preparation of the book. Electronic Packaging and Production is published monthly.
In addition, the following publishers/organisations granted permission for some of the other papers to be reprinted in the book, and IFS Publications would like to express its appreciation of their cooperation.
Assembly Engineering Hitchcock Publishing Company 25W550 Geneva Road Wheaton, IL 60188 USA
Printed Circuit Assembly PMS Industries 1790 Hembree Road Alpharetta, GA 30201 USA
Assembly Automation IFS Publications 35/39 High Street Kempston Bedford MK42 7BT UK
Society of Manufacturing Engineers One SME Drive POBox930 Dearborn, MI 48121 USA
AT & T Technologies Inc. Engineering Research Center Princeton, NJ 08540 USA
IFS Conferences 35/39 High Street Kempston Bedford MK42 7BT UK
Machine and Tool Blue Book Hitchcock Publishing Company 25W550 Geneva Road Wheaton, IL60188 USA
The General Electric Company PLC.,
I Stanhope Gate London W 1A l EH
UK
Preface When offered the challenge of collating and editing a series of papers on electronics assembly, I accepted the task with mixed feelings. As one who has spent his life in the field of mechanized assembly I have viewed the developments of mechanized electronics assembly and testing with professional interes
