RF SOP (System On Package) Using Passive Embedded Substrate
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1075-J01-03
RF SOP (System On Package) Using Passive Embedded Substrate NamKee Kang, Junchul Kim, Dongsu Kim, ChanSei Yoo, JongIn Ryu, and Hyunmin Cho ELECTRONIC MATERIALS & DEVICE PACKAGING RESEARCH CENTER, KOREA ELECTRONIC TECHNOLOGY INSTITUTE, # 68 Yatap-dong, Bundang-gu, Seongnamsi, Gyeonggi-do, 463-816, Korea, Republic of ABSTRACT The convergence paradigm of today, which can be characterized as multi function and high effectiveness, strongly requires an integration of RF/analog function and high-speed digital function into a single IC or package. System on Package (SOP) is a promising technology for system integration in order to meet these current trends and requirements. A passive embedded substrate is one of the most critical issues to achieve small-size and high-functional devices and modules with high integration density and deign flexibility for wireless communications. This paper will describe integration approach for passive embedded substrate for RF applications. With the several examples such as multi-band front end module and passive/active integrated modules, the advantages of the integration using passive embedded substrates will be described with some design considerations. INTRODUCTION With unceasing increase market demand for wireless communications, there has been the added pressure to minimize the size and to increase the density of the integration of commercial RF components and modules. Moreover, wireless communication systems demand a large number of the passive components which have short lifetime. To meet these trends, board-level integration is strongly required in comparison with system-on-chip (SOC), which has inherently some limitations such as integration complexity, high cost, intellectual property issues. Thus, SOP can be an alternative integration approach to overcome the shortcoming of SOC and conventional packaging. An LTCC is one of the reasonable solutions for the small-size devices and modules with embedded passives especially in wireless communications [1-4]. In this paper, using examples of RF front end module for WLAN and multi-band front end module, benefits of using RF SOP module and consideration for the design of passive embedded substrate will be described. In addition to that, using CDMA front end module, the
effects of the process about co-firing heterogeneous dielectrics and constraint sintering will be also described. Passive Embedded Substrate A passive embedded substrate can be defined as a module substrate with embedded passive components like resistors, capacitors and inductors to implement highly integrated system level package. Resistors can be integrated in or on the package substrate using several processes. Because resisters are usually affected by their physical structures and material tolerances, they should be placed on the surface of the substrate to be trimmed for accurate tolerance. The main components for embedded passive substrates are capacitors and inductors. Capacitors and inductors are simple to be embedded into the module substrate using c
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