Advanced Materials for Thermal Management of Electronic Packaging
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With incre
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The Springer Series in Advanced Microelectronics provides systematic information on all the topics relevant for the design, processing, and manufacturing of microelectronic devices. The books, each prepared by leading researchers or engineers in their fields, cover the basic and advanced aspects of topics such as wafer processing, materials, device design, device technologies, circuit design, VLSI implementation, and subsystem technology. The series forms a bridge between physics and engineering and the volumes will appeal to practicing engineers as well as research scientists. Series Editors: Dr. Kiyoo Itoh Hitachi Ltd., Central Research Laboratory, 1-280 Higashi-Koigakubo Kokubunji-shi, Tokyo 185-8601, Japan Professor Thomas Lee Department of Electrical Engineering, Stanford University, 420 Via Palou Mall, CIS-205 Stanford, CA 94305-4070, USA Professor Takayasu Sakurai Center for Collaborative Research, University of Tokyo, 7-22-1 Roppongi Minato-ku, Tokyo 106-8558, Japan Professor Willy M.C. Sansen ESAT-MICAS, Katholieke Universiteit Leuven, Kasteelpark Arenberg 10 3001 Leuven, Belgium Professor Doris Schmitt-Landsiedel Lehrstuhl fu¨r Technische Elektronik, Technische Universita¨t Mu¨nchen Theresienstrasse 90, Geba¨ude N3, 80290 Mu¨nchen, Germany
For other titles published in this series, go to http://www.springer.com/series/4076
Xingcun Colin Tong
Advanced Materials for Thermal Management of Electronic Packaging
Xingcun Colin Tong Laird Technologies 1751 Wilkening Court Schaumburg, IL 60173 USA [email protected]
ISSN 1437-0387 ISBN 978-1-4419-7758-8 e-ISBN 978-1-4419-7759-5 DOI 10.1007/978-1-4419-7759-5 Springer New York Heidelberg Dordrecht London # Springer Science+Business Media, LLC 2011 All rights reserved. This work may not be translated or copied in whole or in part without the written permission of the publisher (Springer ScienceþBusiness Media, LLC, 233 Spring Street, New York, NY 10013, USA), except for brief excerpts in connection with reviews or scholarly analysis. Use in connection with any form of information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed is forbidden. The use in this publication of trade names, trademarks, service marks, and similar terms, even if they are not identified as such, is not to be taken as an expression of opinion as to whether or not they are subject to proprietary rights. Cover design: eStudio Calamar S.L. Printed on acid-free paper Springer is part of Springer Science+Business Media (www.springer.com)
This book is dedicated to my wife Dali, our daughter Lingbo, and our sons William and Alan. Their love fully filled my heart during the long hours of work on this book
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Preface
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges became barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements
