Materials for 3D Packaging of Electronic and Optoelectronic Systems
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Materials for 3D
Packaging of Electronic and Optoelectronic Systems
Volkan H. Ozguz and James Yamaguchi Abstract Advanced three-dimensional (3D) packaging techniques for electronic components are promising for the realization of “systems-in-packages.” Three-dimensional packages require the use of a variety of materials within a small physical size range. Materials selection is therefore critical from electrical, optical, mechanical, structural, thermal, and manufacturability viewpoints. The materials combination depends also on the intended application for the 3D packaged modules. This article reviews 3D packaging approaches, materials classes, and examples. Three-dimensional packaged systems using judiciously selected materials offer performance advantages that cannot be provided by planar implementation. Keywords: electronic materials, microelectronics packaging and integration, threedimensional (3D) packaging techniques.
Introduction Advanced three-dimensional (3D) packaging techniques for electronic components are promising for the realization of “systems-in-packages,” which are standalone functional units in a single electronic assembly. Three-dimensional packages require the use of a variety of materials within a small physical size range. Materials selection is therefore critical from electrical, optical, mechanical, structural, thermal, and manufacturability viewpoints. The materials combination depends also on the intended application for the 3D packaged modules. This article reviews 3D packaging approaches, materials classes, and examples. Three-dimensional packaged systems using judiciously selected materials offer performance advantages that cannot be provided by planar implementation. Three-dimensional packaging was initiated in the late 1970s as an effort to increase packaging densities, lower system
MRS BULLETIN/JANUARY 2003
weights and volumes, and improve the electrical performance of components and devices. The main application areas for 3D packaging are systems in which volume and mass are critical. Historically, focalplane arrays with on-board processing, and solid-state data-recorder applications for military and commercial satellites, have driven the development of 3D packages for data memory. For example, the data-storage unit of the Hubble Space Telescope consists of 3D stacked memory chips. Recently, 3D packaging has appeared in high-end portable equipment, such as stacked SRAM (static randomaccess memory) chips in cellular telephones, for the size savings it allows. These applications have combined memory chips with a controller or used a few layers of stacked memory chips, indicating that the cost of a limited number of stacked layers has come down enough to
be acceptable for mainstream commercial applications.
Review of 3D Packaging Approaches Three-dimensional packaging approaches, often referred to as stacking, can be grouped under the following categories and are illustrated in Figure 1. Chip stacking: Unpackaged integrated circuits (ICs) are stacked and interconnected to ach
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