Dielectric properties of polyethersulfone copolymers containing bisphenol S and six fluorine hexafluorobisphenolA (6AF)
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ORIGINAL PAPER
Dielectric properties of polyethersulfone copolymers containing bisphenol S and six fluorine hexafluorobisphenolA (6AF) segments Jialing Xia 1 & Zejun Pu 1 & Xiaoyi Zheng 1 & Linqing Hu 1 & Xianguang Zeng 1 & Jiachun Zhong Received: 26 May 2020 / Accepted: 18 August 2020 # The Polymer Society, Taipei 2020
Abstract In this study, a series of fluorinated polyethersulfone (PES-6AF) copolymers with intrinsic low-dielectric-constants are prepared by the introduction of fluorine-containing group, which are derived from the polycondensation reaction of 4,4′-dichlorophenyl sulfone (DCS), bisphenol S (BPS) and six fluorine hexafluorobisphenolA (6AF) compounds by nucleophilic aromatic substitution. Different proportions of PES-6AF copolymers show high glass transition temperatures (Tg) ranging from 206 °C to 230 °C, and the thermal decomposition temperatures of PES-6AF copolymers are up to 500 °C under N2 atmospheres. The PES-6AF copolymers display outstanding tensile strength (62–69 MPa). Added different proportions of 6AF into the PES-6AF copolymers could improve dielectric property and decrease dielectric constant (k) from 3.6 to 2.5 at 1 kHz. In addition, the dielectric properties were found to be relatively stable until the Tg, it is because that the 6AF units were existed in the molecular backbone. Furthermore, the PES-6AF copolymers were soluble in many common solvents and could be made the molten films using DMF as solvent. Keywords Fluorinated polyethersulfone . Copolymers . Dielectric properties . Thermal decomposition temperature
Introduction With the rapid development and application of ultra-large integrated circuits (ULSI), the chip tends to be miniaturized and the feature size of the device is decreasing, which will be the future development trend [1, 2]. Meanwhile, the integration of the circuit is getting higher and higher, which will cause the interconnect delay of the circuit to increase gradually [3, 4] and the application of electronic, especially 5G communication technology and higher frequency communication technology will be influenced by a series of problems (such as delay in signal transmission, noise interference and increased power loss) in medical industry, machinery industry and other fields. To solve these problems, the high-performance low-k and low electromagnetic radiation materials [5–7], in
* Zejun Pu [email protected] 1
College of Materials Science and Engineering, Material Corrosion and Protection Key Laboratory of Sichuan province, Key Laboratories of Fine Chemicals and Surfactants, Sichuan Provincial Universities, Sichuan University of Science & Engineering, Zigong 643000, China
particular the polymers with intrinsic low-dielectric-constant have paid much attention in recent years. It is beneficial to reducing signal delay, decreasing power consumption and improving the signal transmission speed [8]. Therefore, the study of novel high-performance low-k materials has become one of the most important topics in material fields. These materials will be used in semic
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