Dimensioning and Realization of an LTCC Multilayer Capacitor for Energy Conversion
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Transactions on Electrical and Electronic Materials https://doi.org/10.1007/s42341-020-00207-x
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Dimensioning and Realization of an LTCC Multilayer Capacitor for Energy Conversion Tekkouk Adda Benattia1 · Rabia Melati1,2 · Hadj Larbi Beklaouz1 · Hamid Azzedine2 · Vincent Bley3 · Celine Combettes3 · Mohammed Ridha Benzidane1 Received: 27 November 2019 / Revised: 16 May 2020 / Accepted: 30 May 2020 © The Korean Institute of Electrical and Electronic Material Engineers 2020
Abstract In this paper, we present the dimensioning as well as the thermal and electrostatic modelling of a multilayer capacitor lowtemperature co-fired ceramic (LTCC) to insert it in a Buck converter. We also present the different stages of the realization of the LTCC capacitor. Our aims are volume and weight reduction, good frequency behaviour, low values of the series inductance and series resistance, and small ripples of the output voltage. The results obtained after the realization are satisfactory and encouraging, with a 92% reduction in volume and 99% in the surface area. To validate the correct operation of the capacitor, we used the PSIM simulation software to compare the voltage and current waveforms of the outputs of the Buck converter with a perfect capacitor and others with LTCC capacitor. COMSOL multiphysics simulation software allowed us to determine the operating temperature of the LTCC capacitor and to validate its electrostatic behaviour (distribution of electrical potential, of electrical field and electrical current density). The multilayer capacitor is manufactured in the LAPLACE laboratory at Paul Sabatier University. Keywords Passive component · DC/DC converter · Multilayer capacitor · LTCC technology · Integration
1 Introduction Capacitors have today gone beyond their traditional function of charge accumulator to take great importance in signal filtering. A race is therefore engaged to increase their effectiveness. To achieve high capacitance values, the usual method is to connect several capacitors in parallel. This method is often applied to the detriment of a larger volume and goes against the necessary compactness of the power conversion elements, in embedded systems.
* Tekkouk Adda Benattia tekkouk.addabenattia@univ‑mosta.dz 1
Department of Electrical Engineering, Faculty of Sciences and Technology, University of Mostaganem, 27000 Mostaganem, Algeria
2
Department of Electrical Engineering, Laboratory of Applied Power Electronic, University of Sciences and Technology of Oran (USTO-MB), 31000 Bir El Djir, Oran, Algeria
3
LAPLACE Laboratory, University of Paul Sabatier, Toulouse, France
To meet the different objectives of portable electronics, three types of capacitors are commonly used in integrated circuit applications: MOS (Metal–Oxide–Semiconductor) [1, 2], MIM (Metal–Insulator-Metal) [3–5] and MOM (Metal-Oxide-Metal) capacitors [6, 7]. Of these capacitors, the MOS has the highest density of capacitance per unit area, due to its thin-gate oxide structure [4]. However, because of the inc
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