Effect of Carboxylic Acids on Reactive Transfer Printing of Copper Formate Ink
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MRS Advances © 2018 Materials Research Society DOI: 10.1557/adv.2018.21
Effect of Carboxylic Acids on Reactive Transfer Printing of Copper Formate Ink Yitzchak S. Rosen and Shlomo Magdassi The Hebrew University of Jerusalem, Casali Center of Applied Chemistry, Institute of Chemistry, Jerusalem 91904, Israel.
ABSTRACT
During decomposition of copper formate, a volatile intermediate is formed, that can be utilized to fabricate conductive copper lines for electrical interconnections. By the method called Reactive Transfer Printing (RTP), a pattern of copper (II) formate was printed, and placed adjacent to a second surface; decomposition of the printed pattern led to a transfer of copper to the second substrate. It was found that the yield of the transfer process improved due to presence of several carboxylic acids which are liquid with a high boiling point. Furthermore we found that the transport of copper starts at a lower temperature than previously reported, indicating that the first decomposition step of copper formate is related to the catalytic decomposition of formic acid on a copper surface. The findings enable printing of conductive copper patterns onto the interior surface of a glass vessel.
Introduction Korosy [1] described how during decomposition of copper formate at about 200 °C, part of the material evolves to an unstable volatile intermediate which was transported to a nearby hot glass surface, where it quickly decomposed, forming a metallic copper mirror. Keller and Korosy [2] isolated the volatile intermediate and identified it as copper (I) formate, found that it decomposes at temperatures above 105 °C, and reported that up to 25% of the copper was transported and deposited on nearby surfaces. By Mass Spectra analysis, Edwards [3] found that the volatile intermediate is most likely a dimer of copper (I) formate. According to Galwey [4, 5], the formation of the volatile intermediate is a central step in the overall decomposition reaction of copper formate. Copper formate decomposes rapidly at temperatures above 180 °C, and in an inert environment the only solid product of the decomposition is pure copper, while the formate component of the copper salt is fully decomposed to carbon dioxide and hydrogen. Keller et al [2] suggested the following decomposition reactions:
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The release of the volatile intermediate is the base for a new method that we have developed [6], Reactive Transfer Printing (RTP), to fabricate conducting copper patterns on 2D and 3D surfaces. By this method a pattern of copper (II) formate was printed (on a “donor-substrate”), and placed adjacent to a second surface (“acceptorsubstrate”); decomposition of the printed pattern led to transfer of copper to the acceptorsubstrate. The transfer mechanism involves the ma
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