Effect of groove rolling on the microstructure and properties of Cu-Nb microcomposite wires
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Effect of groove rolling on the microstructure and properties of Cu–Nb microcomposite wires Peng-fei Wang 1,2), Ming Liang 2), Xiao-yan Xu 2), Jian-qing Feng 2), Cheng-shan Li 2), Ping-xiang Zhang 1,2), and Jin-shan Li 1) 1) School of Materials, Northwestern Polytechnical University, Xi’an 710072, China 2) Northwest Institute for Nonferrous Metal Research, Xi’an 710016, China (Received: 4 February 2020; revised: 24 March 2020; accepted: 13 April 2020)
Abstract: Cu–Nb microcomposite wire was successfully prepared by a groove rolling process. The effects of groove rolling on the diffraction peaks, microstructure, and properties of the Cu–Nb microcomposite were investigated and the microstructure evolutions and strengthening mechanism were discussed. The tensile strength of the Cu–Nb microcomposite wire with a diameter of 2.02 mm was greater than 1 GPa, and its conductivity reached 68% of the International Annealed Copper Standard, demonstrating the Cu–Nb microcomposite wire with high tensile strength and high conductivity after groove rolling. The results show that an appropriate groove rolling method can improve the performance of the Cu–Nb microcomposite wire. Keywords: groove rolling; microstructure; strengthening mechanism; copper–niobium microcomposites
1. Introduction Cu–Nb microcomposites have attracted interest for their excellent mechanical strength, high conductivity, and high temperature resistance [1–3]. The Cu–Nb microcomposite has a good combination of mechanical strength and conductivity properties, and is often the best candidate for a high magnetic field magnet. Therefore, it is of great significance to develop and research Cu–Nb microcomposites to further their performance [4]. The microstructural stability of Cu–Nb microcomposites wires fabricated by a bundling and drawing process has been successfully applied to the Wuhan National High Magnetic Field Center, China, and a pulsed high magnetic field of 90.6 T has been achieved. However, there is a need for further improvements in the performance of Cu–Nb microcomposite wire to aid the rapid development of the pulsed high magnetic field. In theoretical predictions to surpass a pulse magnetic field of 100 T, the tensile strength of the conductor material needs to be greater than 1 GPa; however, it also must have good conductivity [5]. Cu–Nb microcomposite wire is mainly fabricated by an accumulative drawing and bundling (ADB) process. This preparation technology is approaching the theoretical limit of Cu–Nb microcomposite wire and the tensile
strength of the Cu–Nb microcomposite wire has stayed at 900–1000 MPa; however, the conductivity of the Cu–Nb microcomposites decreased rather than increased as the tensile strength increased. Methods to refine the size of the Nb filaments, increase the Cu/Nb contact area, and increase the number of the Cu/Nb interfaces can improve the mechanical properties of the Cu–Nb microcomposite [6]. Therefore, new structural materia
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