Effect of nickel phyllosilicate on the morphological structure, thermal properties and wear resistance of epoxy nanocomp
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ORIGINAL PAPER
Effect of nickel phyllosilicate on the morphological structure, thermal properties and wear resistance of epoxy nanocomposites Ji-nian Yang 1
&
Zhen-yu Li 1 & Yu-xuan Xu 2 & Shi-bin Nie 2 & Yue Liu 1
Received: 2 February 2020 / Accepted: 10 August 2020 # The Polymer Society, Taipei 2020
Abstract To improve the comprehensive properties of epoxy resin (EP), the lamellar nanofiller of nickel phyllosilicate (Ni-PS) was first synthesized hydrothermally and EP/Ni-PS nanocomposites were prepared via a solution-mixing process. The effect of Ni-PS content on the morphological structure, curing behavior, thermal stability, flammability as well as the tribological property under the dry sliding conditions of the nanocomposites were investigated carefully. Various characterizations have identified that the as-synthesized Ni-PS is characterized by good crystals and excellent thermal stability. The adequate Ni-PS could disperse homogeneously in the EP matrix, depicting the positive influences on the curing behavior and thermal stability at high temperatures. The incorporation of Ni-PS also increases the limited oxygen index and presents good suppression on the fire spreading for the nanocomposites; however, all the samples fail to pass any ratings of UL-94. By contrast, such inorganic filler depicts an exciting improvement in the tribological responses, showing both decreased coefficient of friction and specific wear rate for EP nanocomposites when compared to pure EP. Keywords Nickel phyllosilicate . Curing behavior . Flammability . Thermal stability . Tribological property
Introduction Epoxy resin (EP) is the most popular thermosetting polymer characterized by good properties and processability, which has been widely applied in various fields of electronics, automobile, machinery, aerospace, communication and petrochemical industry [1]. EP can be served as the integrated circuits, transistors, capacitors and printed circuit boards in the electronics industry while the carbon fiber reinforced
Electronic supplementary material The online version of this article (https://doi.org/10.1007/s10965-020-02250-x) contains supplementary material, which is available to authorized users. * Ji-nian Yang [email protected]; [email protected] * Shi-bin Nie [email protected] 1
School of Materials Science and Engineering, Anhui University of Science and Technology, Huainan 232001, People’s Republic of China
2
School of Energy Resources and Safety, Anhui University of Science and Technology, Huainan 232001, People’s Republic of China
laminates in the aircraft due to the much higher strength to weight than the steel and aluminum alloys. It is also utilized as the structural glue to replace welding in the automotive and used for the most cost-effective organic coatings to protect the metal and alloys in the marine environment due to its excellent chemical resistance [2]. Though EP shows many superior performances than other thermosetting polymers, it also suffers from some obvious disadvantages of relative high brittle
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