High quality NH 2 SAM (self assembled monolayer) diffusion barrier for advanced copper interconnects
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SAM (Self Assembled Monolayer) Diffusion Barrier for Advanced Copper Interconnects Arantxa Maestre Caro, L. Zhao, Guido Maes, Gustaaf Borghs, Gerald Beyer, Zsolt Tőkei, Silvia Armini and Youssef Travaly MRS Proceedings / Volume 1249 / 2010 DOI: 10.1557/PROC1249F0201
Link to this article: http://journals.cambridge.org/abstract_S1946427400002190 How to cite this article: Arantxa Maestre Caro, L. Zhao, Guido Maes, Gustaaf Borghs, Gerald Beyer, Zsolt Tőkei, Silvia Armini and Youssef Travaly (2010). High Quality NH2SAM (Self Assembled Monolayer) Diffusion Barrier for Advanced Copper Interconnects. MRS Proceedings,1249, 1249F0201 doi:10.1557/PROC1249F0201 Request Permissions : Click here
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Mater. Res. Soc. Symp. Proc. Vol. 1249 © 2010 Materials Research Society
1249-F02-01
High quality NH2SAM (self assembled monolayer) diffusion barrier for advanced copper interconnects Arantxa Maestre Caro1, 2, Larry Zhao3, Guido Maes2, Gustaaf Borghs1, Gerald Beyer1, Zsolt Tokei1, Silvia Armini1and Youssef Travaly1 1
Imec, 75 kapeldreef, Leuven, B-3001, Belgium. Department of Chemistry Katholieke Universiteit Leuven (KUL), Celestijnenlaan 200 F, Leuven, B-3001, Belgium. 3 Intel assignee at Imec 2
* Corresponding author: Arantxa Maestre Caro, Imec, Kapeldreef 75, B-3001 Leuven, Belgium. Tel.: +32 (0) 16 28 80 71. Fax: +32 (0) 16 28 15 76. E-mail: [email protected]
ABSTRACT In this work, the quality of an amino-terminated SAM barrier (NH2SAM) is tested. A high density and the absence of pinholes in the barrier layer are essential for a good barrier performance in the copper interconnects. The quality of the NH2SAM layer has been assessed by water contact angle (C.A) and High resolution AFM (HR-AFM). The density and the closure of the film have been monitored by X-Ray Reflectivity (XRR), Ellipsometry and Cylic Voltametry (CV). Already for 1min deposition, the C.A value changes from
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