Influence of structural and surface properties of MgO thin film as a heat spreader on high power LED performance
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Influence of structural and surface properties of MgO thin film as a heat spreader on high power LED performance Muhammad Sani Idris1,2 · Shanmugan Subramani1 Received: 24 March 2020 / Accepted: 14 July 2020 © Springer Science+Business Media, LLC, part of Springer Nature 2020
Abstract Thermal management difficulties in light emitting diodes (LEDs) incredibly impacts LEDs performance, reliability, and lifespan. To find a lasting solution to LEDs thermal management difficulties, MgO thin film was deposited on Cu substrate and used as heat spreader for LED package. Influence of structural and surface properties on thermal performance of LED was investigated by XRD, FESEM and AFM. Optimum LED thermal performance was recorded from the LED mounted to MgO heat spreader with low microstrain of 7.3 × 10–3, uniform particle size (34 nm), surface roughness (4.5 nm) and minimum peakvalley distance (1.90 nm). Thermal conductivity and thermal transient characterization illustrated that 0.6 M MgO thin film showed 15.73 W/mK, higher junction temperature difference (18.06 °C) with higher total thermal resistance difference (3.35 K/W). Improved illumination and reduction in LED surface temperature were recorded using MgO heat spreader from optical and thermal infrared analysis. Therefore, magnesium oxide thin film would be suggested as a heat spreader for enhancing LED’s thermal management. Keywords Magnesium oxide thin film peak-valley distance · Thermal resistance · Colorcorrelated temperature · Infrared images
1 Introduction Towards improving and sustenance of thermal management of solid-state lighting, air gaps generated between two solid contact surfaces occupying surface irregularities which must be eliminated and filled with high thermally conductive materials. Doing so will result in reducing thermal contact resistance and achievement of excellent thermal contact conductance in the interface (Shanmugan et al. 2017; Lim et al. 2018; Liu et al. 2016). Research had proved that thermal resistance follows a straight line as a function of bond
* Shanmugan Subramani [email protected] Muhammad Sani Idris [email protected] 1
School of Physics, University Sains Malaysia (USM), 11800 Minden, Pulau Pinang, Malaysia
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Department of Physics, Federal College of Education, Kano, Nigeria
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line thickness (BLT) in materials as well as low thermal resistance with interfaces of low surface roughness and free from air gaps (Shanmugan et al. 2017; Lim et al. 2018). Numerous nitride and oxide ceramics have been designed and developed for improvement in the dissipation of excessive heat generated within lighting and electronic devices to ambient (Shanmugan et al. 2017; Lim et al. 2018; Liu et al. 2016; Terakado et al.2018). Dissipation of the extreme heat to ambient would results in light emitting diodes (LEDs) and electronics devices to have and maintain a low junction temperature, prevents the shift in color of the LEDs, improvement in light em
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