Interface Stability between Ni-P film plated by Supercritical Electroless Plating and the Polymer Substrate
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Interface Stability between Ni-P film plated by Supercritical Electroless Plating and the Polymer Substrate Byung-Hoon Woo1, Masato Sone1, Akinobu Shibata1, Chiemi Ishiyama1, Masahiro Yamagata2, Kaoru Masuda3, and Yakichi Higo1 1 Precision and Intelligence Laboratory, Tokyo Institute of Technology, 4259 Nagatsuta, Midoriku, Yokohama, 226-8503, Japan 2 Machinery & Engineering Company, Kobe Steel, Ltd, 2-3-1 Shinhama, Arai-cho, Takasago, Hyogo, 678-8670, Japan 3 Applied Chemistry Division, Kobelco Research Institute, LtdInc., 1-5-5 Takatsukadai, Nishi-ku, Kobe, 651-2271, Japan ABSTRACT We propose a novel technique for electroless plating on polymer substrates using a dense CO2 beyond the critical point. Ni-P thin films were fabricated by a novel, hybrid technique consisting of two processes: catalyzation in supercritical CO2 with Pd bis-acetylacetonate and electroless plating in emulsion with dense carbon dioxide. Catalyzation in supercritical CO2 enabled the nucleation of a large number of Pd nuclei on a polyimide substrate without chemical pretreatment, and the deposition of a uniform Ni-P metal film. The electroless plating in emulsion with dense carbon dioxide produced a uniformly plated film without peeling or nodules. The improved uniformity was attained by the solubility and diffusivity of the dense CO2 beyond the critical point in the emulsion. INTRODUCTION Recently, there are many reports on the application of Micro-Electro-Mechanical Systems (MEMS), which are integrations of mechanical elements, sensors, actuators and electronic components on silicon, manufactured using micro-fabrication technology. MEMS has basically been developed by the same process used to fabricate semiconductors. The flexible and biocompatible properties of polymer make polymer MEMS a promising candidate for the next generation of micro devices. Flexible micro devices and bio-medical micro devices such as micro blood checkers are already envisioned. [1] Dry processes such as chemical vapor deposition (CVD) and wet processes such as electroplating are used to fabricate metallic circuits and mechanical systems on polymer substrates. The CVD process, specifically, limits the volatility of stable precursors such as organo-metallic complex and leads to low vapor phase concentration and mass transfer-limited reactions that interrupt uniform deposition. [2] In wet processes, meanwhile, the use of electroless plating and electroplating to fabricate micro-sized
structures is beset with obstacles. Important obstacle is the formation of pinholes and voids by hydrogen bubbles generated by the sub-reaction of electroless plating or the electrolysis reaction of water and the formation of nodules due to growing crystals. [3] In processes for plating on polymer, catalyzation has been essential. The best way to improve the speed of the metallization on polymer will be to develop a novel micro-fabrication technique for plating metal on polymer substrate. Yet polymer substrates are hydrophobic and thus respond poorly to the wetness of the
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