Investigation of Ultralow Loss Interconnection Technique for LTCC based System-in-Package(SIP) Technology at 60GHz
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0969-W01-04
Investigation of Ultralow Loss Interconnection Technique for LTCC based System-inPackage(SIP) Technology at 60GHz Dong-Young Kim, Jae Kyoung Mun, Dong-Suk Jun, and Haechoen Kim Microwave Device Team, ETRI, 161 Gajeong-dong, Yuseong-gu, Daejeon, 305-700, Korea, Republic of
ABSTRACT The effects of wire and ribbon bonded interconnection on the transmission characteristics at millimeter wave frequency range was presented. The insertion loss and return loss was closely related with the ratio of the signal line width to that of bonded wire or ribbon. The most promise condition for low loss interconnection was that the width of bonded wire or ribbon should be compatible to the width of signal lines. In the measurement of amp module fabricated using low temperature co-fired ceramics (LTCC) technique, the insertion loss due to LTCC packaging is very small which means that the loss due to bonding itself is nearly negligible. However, S11 and S22 degraded severely due to the interconnection. A new transition structure was introduced in order to compensate this degradation of S11 and S21. INTRODUCTION System and hardware investigations on the broadband wireless access at 60GHz band have been widely conducted around the world [1]. These applications required compact, high performance, and low-cost wireless equipment. Low temperature co-fired ceramics (LTCC) is one of the most promise candidates in system-in-package (SiP) at millimeter wave bands. LTCC technology has many advantages such as low loss in millimeter wave bands, high integration density, and high reliability. LTCC is a multilayer ceramic technology, which provides an ability to embed passive component in layers while the active elements are mounted on the surface layer. Despite the emergence of new packaging and interconnect technologies, wire-bonding method remains the dominant conventional chip connection technology with low cost, high reliability and high manufacturability [2]. With increasing frequency from microwave to millimeter wave frequency range, however, wire bonds exhibits increased parasitic effects that deteriorate the module performance [3]. In addition, radiation loss due to discontinuity caused by wire bends on both ends of the wire becomes significant, particularly in the millimeter wave frequency range [4]. Sutano et. el. reported the investigation on the transmission characteristic of wire and ribbon bond interconnection at millimeter wave frequency range . However, their result showed the measured characteristic under 40GHz [5]. In this paper, we present the millimeter wave transmission characteristic of wire bonding on CBCPW (conductor backed coplanar waveguide) lines with one or two dielectric layers (100µm or 200µm thickness). The mechanism of increased return loss of wire-bonded module will be presented, and ultra low loss configuration of interconnection will be suggested.
EXPERIMENT Ferro A6S and thermally matched gold and silver conducting pastes were used to fabricate the CBCPW line patterns. Vias were formed through mecha
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