Journal of Materials Research
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Journal of Materials Research Articles in the August 1991 Issue (Vol. 6, No. 8) A Review of Récent Developments on Fé3Al-Based Alloys, by C.G. McKamey, J.H. DeVan, P.F. Tortorelli, and V.K. Sikka. Approximants to the Icosahedral and Decagonal Phases in the Al-Cu-Cr System, by S. Ebalard and F. Spaepen. Characteristics of Oxide Thin Films from Carboxylate Precursors, by P-Y. Chu and R.C. Buchanan. Characterization and Control of Phase Ségrégation in the Fine Particles of BaTi0 3 and SrTï0 3 Synthesized by the Spray Pyrolysis Method, byK. Nonaka, S. Hayashi, T. Yano, K. Okada, and N. Otsuka. Effect of Oxygen on the Formation of End-of-Range Disorder in Implantation Amorphized Silicon, by E. Lorenz, J. Gyulai, L. Frey, H. Ryssel, and N.Q. Khanh. Effects of Alloying and Treatment on Void Swelling of 316 Stainless Steel, by B.X. Liu, S.L. Lai, and J.G. Sun. Electron Microscopy Characterization of Monoclinic SiAs Précipitâtes in Heavily As + Implanted Silicon, by A. Armigliato and A. Parisini. Extension of Gladman's Model for Abnormal Grain Growth, by C.H. WSrner, S.R. Romero, andP.M. Hazzledine. Fabrication and Tensile Properties of Continuous-Fiber Reinforced Ni 3 Al-Al 2 0 3 Composites, by J.H. Schneibel, E.P George, C.G. McKamey, E.K. Ohriner, M.L. Sàntella, and C.A. Carmichael. Fabrication of Superconducting YBa2Cu307_x Fibers by the SolGel Method Using Métal Alkoxides, by S. Katayama and M. Sekine. Hardness of Ion-Implanted Ni3Al and TLA1, by G.S. Was. Highly Mobile Oxygen Hole-Type Charge Carriers in Fused Silica, by F. Freund and M.M. Masuda. Infrared Réflectance Spectroscopy of Electrochromic NiO x H„ Films Made by Reactive de Sputtering, by W. Estrada, A.M. Andersson, C.G. Granqvist, A. Gorenstein, and F. Decker.
Laser Induced Fractal Crystallites in Amorphous Te-Se-Br Films, by T. Carrière, C. Ortiz, and G. Fuchs. Mg-Ti-Spinel Formation at the TiN/MgO Interface by SolidState Reaction: Confirmation by High-Resolution Electron Microscopy, by L. Hultman, D. Hesse, and W-A. Chiou. Microstructural Glass Modifications in As-Fired and HighVoltage-Surged Ru0 2 -Based Thick Film Resistors, by K. Adachi, S. Iida, J. Ishigame, and S. Sekihara. Microstructure-Property Relations in Tungsten Bronze Lead Barium Niobate, Pb 1 . x Ba x Nb 2 0 6 , by C.A. Randall, R. Gup, A. S. Bhalla, and L. E. Cross. Photopyroelectric (PPE) Détermination of Thermal Diffusivity of Bi2Te2 85Se015 Sintered Thermoelectric Semiconductors, by H. Wada, M. Watanabe, J. Morimoto, and T. Miyakawa. Reaction of Beta-Phase Ni-Al Alloys with CrB2, by A.K. Misra. Shielding of Cracks in a Plastically Polarizable Material, by S.J. Zhou and R. Thomson. Sol-Gel Route to High Tc Ceramic Precursors, by T.E. Karis and J. Economy. Stability of the YBa2Cu307.x-Si Interface, by B. Li and E.D. Williams. Structural and Electrical Investigation of Amorphous-toCrystalline Transformation in Iron Disilicide Alloy Thin Films, by M. Michelina, F. Nava, and E. Galli. Structural Model for Nitrogen Incorporation in Phosphate Glasses, by M.R. Reidmeyer and D.E. Day. The Surface
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