Journal of Materials Research
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Journal of Materials Research Articles in the August 1990 Issue (Vol. 5 No. 8)
Rapid Communications Crystalline Perfection of Chemical Vapour Deposited Diamond Films, by A.V. Hetherington, C.J.H. Wort, and P. Southworth. Epitaxial Growth of /3-SiC on Si by Low-Temperature Chemical Vapor Déposition, by M. Iqbal Chaudhry and Robert L. Wright. Articles Surface Résistance Measurement of Superconducting YBa2Cu,0 7 in a Magnetic Field, by C.C. Chin, P.J. Rainville, A.J. Drehman, J.S. Derov, J. Steinbeck, G. Dresselhaus, and M.S. Dresselhaus. Characterization of Spray-Pyrolized Superconducting YBaCuO Thin Films on Single-Crystal MgO by Transmission Electron Microscopy, by S.J. Golden, H. Isotalo, M. Lanham, J. Mayer, F.F. Lange, and M. Riihle. Additive Enhanced Non-Aqueous Electrodeposition of Silver on Ba2YCu307, by J.M. Rosamilia and B. Miller. Infrared Properties of the High Tc Superconductor Ty3a2CaCuA- by H.J. Ye, R.P. McCall, J.M. Leng, C.G. Li, Yu-Ling Zhang, Ning Cao, Jia-Gi Zheng, and S.S. Xie. Polytypoids in High Tc Thallium-Based Superconducting Materials, by A.K. Singh, M.A. Imam, K. Sadananda, S.B. Qadri, E.F. Skelton, M.S. Osofsky, V. Le Tourneau, and D.U. Gubser. An Electron Diffraction Study of BijSr^GdxCaLxJosCujOs^, by J. Kulik, Y. Y. Xue, Y.Y. Sun, and M. Bonvalot. Brittle Cleavage of Ll 2 Trialurninides, by E.P. George, J.A. Horton, W.D. Porter, and J.H. Schneibel. Ultra Rapid Heating, by Spontaneous Mixing Reactions in Metal-Metal Multilayer Composites, by E Bordeaux and A.R. Yavari. On the Nature of the Oxygen-Related Defect in Aluminum Nitride, by J.H. Harns, R.A. Youngman, and R.G. Teller.
Microstructure and Morphology of Surface Oxide Films on Ti6A14V, by M. Ask, U. Rolander, J. Lausmaa, and B. Kasemo. Surface Mechanical Properties of Aluminum Implanted Nickel and Co-evaporated Ni-Al on Nickel, by Gary S. Was. The Chemical Compatibility and Tensile Behavior of An NiaAl-Based Composite, by G.E. Fuchs. Microstructure and Mechanical Behavior of Al-Mg/Ni-P Composites, by V. Raman. Polyacetylene as Heterogeneous Catalyst for Electroless Déposition of Bulk Amorphous Metals, by S.J. Kamrava and S. Sôderholm. Formation Process of CuCl2-NiCl2-Graphite Intercalation Compounds, by M. Inagaki and M. Ohira. Effects of Lithium Oxide on the Electrical Properties of CuO at Low Températures, by F. Lanza, R. Feduzi, and J. Fuger. Corrélation Between Structure, Energy, and Idéal Cleavage Fracture for Symmetrical Grain Boundaries in FCC Metals, byD.Wolf. Fracture Toughness of Macro-Defect Free Cernent Using Small Crack Techniques, by Y-S Chou, J.J. Mecholsky, Jr., and M. Silsbee. High Dielectric Constant and Small Température Coefficient Bismuth-Based Dielectric Compositions, by H.C. Ling, M.F. Yan, and W.W. Rhodes. Model for Melting Enthalpy of Sh in Ge-Sn Composites, by D. Turnbull, J.S.C. Jang, and C.C. Koch. Evaluation of a Silicon-Containing Benzocyclobutene Thermoset Resin as a Plasma Etch Stop, by Stephen R. Cain, Luis J. Matienzo, and David W. Wang. Self-Assembly of Octadecyltrichlorosilane Monolayers on Mi
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