Lead Free Solder Mechanics and Reliability
Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks an
- PDF / 45,337 Bytes
- 10 Pages / 439.37 x 666.142 pts Page_size
- 67 Downloads / 205 Views
John Hock Lye Pang
Lead Free Solder Mechanics and Reliability
John Hock Lye Pang School of Mechanical and Aerospace Engineering Nanyang Technological University 50 Nanyang Avenue Singapore 639798 Singapore [email protected]
ISBN 978-1-4614-0462-0 e-ISBN 978-1-4614-0463-7 DOI 10.1007/978-1-4614-0463-7 Springer New York Dordrecht Heildelberg London Library of Congress Control Number: 2011937228 # Springer Science+Business Media, LLC 2012
All rights reserved. This work may not be translated or copied in whole or in part without the written permission of the publisher (Springer Science+Business Media, LLC, 233 Spring Street, New York, NY 10013, USA), except for brief excerpts in connection with reviews or scholarly analysis. Use in connection with any form of information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed is forbidden. The use in this publication of trade names, trademarks, service marks, and similar terms, even if they are not identified as such, is not to be taken as an expression of opinion as to whether or not they are subject to proprietary rights. Printed on acid-free paper Springer is part of Springer Science+Business Media (www.springer.com)
Preface
Green electronic products require the use of lead-free (Pb-free) solder materials for soldering. Semiconductor packaging and electronics manufacturing employ Pb-free solder for silicon chip interconnection and surface mount assembly of integrated circuit (IC) components on a printed circuit board (PCB). Design and reliability evaluation of Pb-free soldered assemblies involves multidisciplinary knowledge in Pb-free solder material, it’s mechanical properties, manufacturing compatibility with IC components and PCB materials, quality of soldering process and solder joint reliability performance in service. The global electronics manufacturing industry has made a critical shift to Pb-free solder materials and soldering technology after more than 40 years of use of tin–lead (Sn–Pb) solders. Since July 2006, the European Commission Directives on “Waste Electrical and Electronic Equipment (WEEE)” and on the “Restriction of the use of certain Hazardous Substances (RoHS)” in electrical and electronics equipment has resulted in a global shift to RoHS compliant Pb-free electronic products. The electronic manufacturing industry has since sucessfully implemented Pb-free solder technology. In America, the National Electronics Manufacturing Initiative (NEMI) organization recommended the use of Pb-free, tin–silver–copper (95.5Sn–3.9Ag–0.6Cu) solder alloy for solder reflow process and tin–copper (99.3Sn–0.7Cu) solder alloy for wave soldering. However, it is now common practice to use different variations of tin–silver–copper (SAC) solder alloys, namely SAC305, SAC387, and SAC405, respectively. This book on “Lead Free Solder: Mechanics and Reliability” provides a comprehensive knowledge base for Pb-free solder mechanical properties, materials constitutive models, fatigue li
Data Loading...
