MEMS Product Engineering
This chapter points out the individual challenges of micro electro mechanical system (MEMS) design issues. Starting from device design according to the idea of the product a concurrent technology design (determining the manufacturing flow) is necessary be
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MEMS Product Engineering
Abstract This chapter points out the individual challenges of micro electro mechanical system (MEMS) design issues. Starting from device design according to the idea of the product a concurrent technology design (determining the manufacturing flow) is necessary because of the strong dependencies between structural and technological properties. Additionally the challenges of packaging and assembling have to be considered in early design stages. Last but not least the aspect of quality assurance becomes more and more important. Modern strategies like Design for Six Sigma (DfSS) adapted to the MEMS design area can substantially improve the quality and the yield in later production processes.
4.1 Getting Started Product Engineering (PE) has already been well defined in earlier sections of this book. In this chapter the challenges of PE in the area of MEMS are within the focus. It differs substantially from other PE approaches. Even very close technology areas like IC design and fabrication use completely different procedures. For instance, Product Engineering in the field of (VLSI) microelectronics mostly deals with the aspect of managing complexity since a set of only few basic components (transistors, diodes, etc.) multiplied in million instances can realize a huge variety of electronic systems [20]. For the field of micro- and nanotechnology (MNT) the main theme could be summed up as managing diversity. First there is diversity regarding the application areas that cover the automotive, medical, and consumer electronics sector among many others. Each area has very different technical and market constraints. Second there is a diversity in engineering domains. MEMS products often combine microelectronic, micromechanic, microoptic, and microfluidic components. Each has different approaches to design and test. Third there is a diversity concerning the available manufacturing technologies. This is best expressed by the MEMS law that states that every device needs an individually
D. Ortloff et al., MEMS Product Engineering, DOI 10.1007/978-3-7091-0706-5__4, © Springer-Verlag Wien 2014
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tailored manufacturing process. Finally, there is diversity regarding the business models of companies involved in MEMS Product Engineering covering the complete scope from Integrated Device Manufacturers (IDM) to Small and Medium Sized Enterprises (SME) for only limited tasks. Recent market surveys like [24, 25] indicate that, besides some large IDMs, there are many SMEs that cover only small parts of the value chain (see Fig. 1.1). In such a scenario Product Engineering is a collaborative effort, comprising several specialized companies that carry out different development tasks at different locations. Most prominent example is the distinction between fabless design houses and pure-play foundries which is already common in the IC industry and is now becoming relevant for MEMS as well [24]. Developing a PE methodology that supports such a diverse and distributed scenario depen
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