MEMS Reliability

Successfully bringing MEMS-based products to market hinges on engineering the component to have sufficient reliability for the intended application, yet the reliability and qualification methodology for MEMS based products is not widely understood. Compan

  • PDF / 14,063,668 Bytes
  • 300 Pages / 439.37 x 666.142 pts Page_size
  • 20 Downloads / 346 Views

DOWNLOAD

REPORT


Series Editors: Stephen D. Senturia Professor of Electrical Engineering, Emeritus, Massachusetts Institute of Technology, Cambridge, Massachusetts Roger T. Howe Professor, Department of Electrical Engineering, Stanford University, Stanford, California Antonio J. Ricco Small Satellite Division, NASA Ames Research Center, Moffett Field, California

For further volumes: http://www.springer.com/series/7724

Allyson L. Hartzell · Mark G. da Silva · Herbert R. Shea

MEMS Reliability

Foreword by Stephen D. Senturia

123

Allyson L. Hartzell Lilliputian Systems, Inc. 36 Jonspin Road Wilmington, MA 01887-1091, USA [email protected]

Mark G. da Silva Analog Devices Inc. RSTC, MS-112 804 Woburn Street Wilmington, MA 01887, USA [email protected]

Herbert R. Shea Microsystems for Space Technologies Laboratory EPFL Rue Jaquet-Droz 1 CH-2002, Neuchatel, Switzerland [email protected]

ISSN 1936-4407 ISBN 978-1-4419-6017-7 e-ISBN 978-1-4419-6018-4 DOI 10.1007/978-1-4419-6018-4 Springer New York Dordrecht Heidelberg London Library of Congress Control Number: 2010935580 © Springer Science+Business Media, LLC 2011 All rights reserved. This work may not be translated or copied in whole or in part without the written permission of the publisher (Springer Science+Business Media, LLC, 233 Spring Street, New York, NY 10013, USA), except for brief excerpts in connection with reviews or scholarly analysis. Use in connection with any form of information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed is forbidden. The use in this publication of trade names, trademarks, service marks, and similar terms, even if they are not identified as such, is not to be taken as an expression of opinion as to whether or not they are subject to proprietary rights. Printed on acid-free paper Springer is part of Springer Science+Business Media (www.springer.com)

Foreword

How long will this MEMS device last? An important question. In fact, for any product that is to succeed in the marketplace, an essential question. The answer, of course, can only be provided on a statistical basis, and the data on which that statistical answer is based come from measurements of in-service lifetimes under aggressive conditions of temperature, humidity, chemical exposure, shock, or other challenges. The design of these accelerated lifetime tests, as well as the corresponding interpretation of data from them, depends on a deep knowledge of the device structure, the constituent materials, the physical mechanisms that might lead to device failure, the dependence of failure rates on such factors as temperature, and both physical and statistical modeling of failure modes. The knowledge base on which this life-testing depends comes from experience with individual device failures, whether so-called infant mortality due to manufacturing defects, or wellunderstood mechanisms, such as corrosion or metal fatigue, that only appear after long exposure to appropriate challenges. Developi