MEMS Packaging and Thermal Issues in Reliability
The potential of MEMS/NEMS technologies has been viewed as a comparable or even bigger revolution than that of microelectronics. These scientific and engineering advancements in MEMS/NEMS could bring applications to reality previously unthinkable, from sp
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37. MEMS Packaging and Thermal Issues in Reliability
37.1 MEMS Packaging ................................... 1111 37.1.1 MEMS Packaging Fundamentals...... 1112 37.1.2 Contemporary MEMS Packaging Approaches ................................. 1113 37.2 Hermetic and Vacuum Packaging and Applications .................................. 1116 37.2.1 Integrated Micromachining Processes .................................... 1117 37.2.2 Post-Packaging Processes.............. 1118 37.2.3 Localized Heating and Bonding...... 1119 37.3 Thermal Issues and Packaging Reliability 1122 37.3.1 Thermal Issues in Packaging .......... 1122 37.3.2 Packaging Reliability .................... 1124 37.3.3 Long-Term and Accelerated MEMS Packaging Tests............................ 1125 37.4 Future Trends and Summary .................. 1128 References .................................................. 1129
echniques, such as packaging design kits for system and circuit designer, low cost and high yield wafer level, chip-scale packaging techniques, effective testing techniques at the wafer-level to reduce overall testing costs; and reliable fabrication of an interposer [37.1] with vertical through-interconnects for device integrations.
37.1 MEMS Packaging MEMS are miniaturized systems in a size of micrometer to millimeter that may have mechanical, chemical, or biomedical features integrated with IC circuitry for sensor or actuator applications [37.2]. For example, pressure [37.3], temperature, flow [37.4], accelerometers [37.5], gyroscopes [37.6], and chemical sensors [37.7] can be fabricated by MEMS technologies for sensing applications. Fluidic valves [37.8], pumps [37.9], and inkjet printer heads are examples of actuation devices for medical, environmental, office, and industrial applications. Silicon is typically used as the primary substrate material for MEMS fabrica-
tion because it can provide unique electrical, thermal, and mechanical properties however also can be easily micromachined in a form of batch-processing and be incorporated with a microelectronic circuits by using most of the conventional semiconductor manufacturing processes and tools. As a result, smaller size, lighter weight, lesser power consumption and cheaper fabrication cost become the advantages of MEMS devices as compared with the existing macroscale systems with similar functionalities. With the advances of MEMS fabrication technology in the past decades, the MEMS market at the component-level is currently in excess of
Part E 37
The potential of MEMS/NEMS technologies has been viewed as a comparable or even bigger revolution than that of microelectronics. These scientific and engineering advancements in MEMS/NEMS could bring applications to reality previously unthinkable, from space systems, environmental instruments, to daily life appliances. As presented in previous chapters, the development of core MEMS/NEMS processes has already demonstrated a lot of commercial applications as well as future potentials with elaborated functionalities. However, a low cost and r
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