More than Moore Technologies for Next Generation Computer Design
This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are know
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More than Moore Technologies for Next Generation Computer Design
More than Moore Technologies for Next Generation Computer Design
Rasit O. Topaloglu Editor
More than Moore Technologies for Next Generation Computer Design
123
Editor Rasit O. Topaloglu IBM Hopewell Junction, NY, USA
ISBN 978-1-4939-2162-1 ISBN 978-1-4939-2163-8 (eBook) DOI 10.1007/978-1-4939-2163-8 Library of Congress Control Number: 2015931070 Springer New York Heidelberg Dordrecht London © Springer Science+Business Media New York 2015 This work is subject to copyright. All rights are reserved by the Publisher, whether the whole or part of the material is concerned, specifically the rights of translation, reprinting, reuse of illustrations, recitation, broadcasting, reproduction on microfilms or in any other physical way, and transmission or information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed. The use of general descriptive names, registered names, trademarks, service marks, etc. in this publication does not imply, even in the absence of a specific statement, that such names are exempt from the relevant protective laws and regulations and therefore free for general use. The publisher, the authors and the editors are safe to assume that the advice and information in this book are believed to be true and accurate at the date of publication. Neither the publisher nor the authors or the editors give a warranty, express or implied, with respect to the material contained herein or for any errors or omissions that may have been made. Printed on acid-free paper Springer Science+Business Media LLC New York is part of Springer Science+Business Media (www.springer.com)
Foreword
This book edited by Rasit Topaloglu is a valuable addition to the library of the student and practicing engineer interested in learning about three emerging aspects of modern system design: three-dimensional integration, emerging memories and their architecture, and photonic communication. These topics are assuming increased importance due to a confluence of multiple factors: the slowing down of conventional silicon scaling that enabled the enormously successful System on a Chip era (mainly for economic reasons), the need for ever-increasing memory at every level of the hierarchy, and finally the need to increase system bandwidth beyond what can be done by conventional interconnects. This book examines the design aspects of these three broad areas along with relevant physics and circuits background for these design constraints. The first two chapters deal with three-dimensional integration and the interconnect challenges of placing Through Silicon Vias (TSVs) in a design environment, especially the impact on area and power. It is important to note that while the TSVs may under certain circumstances increase chip power and area slightly (a few percent), the reduction in these parameters at the board or system level is enormous. For example, in the Hybrid Memory Cube embodiment,1 ma
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