More-than-Moore 2.5D and 3D SiP Integration
This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integr
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More-thanMoore 2.5D and 3D SiP Integration
More-than-Moore 2.5D and 3D SiP Integration
Riko Radojcic
More-than-Moore 2.5D and 3D SiP Integration
123
Riko Radojcic San Diego, CA USA
ISBN 978-3-319-52547-1 DOI 10.1007/978-3-319-52548-8
ISBN 978-3-319-52548-8
(eBook)
Library of Congress Control Number: 2016963318 © Springer International Publishing AG 2017 This work is subject to copyright. All rights are reserved by the Publisher, whether the whole or part of the material is concerned, specifically the rights of translation, reprinting, reuse of illustrations, recitation, broadcasting, reproduction on microfilms or in any other physical way, and transmission or information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed. The use of general descriptive names, registered names, trademarks, service marks, etc. in this publication does not imply, even in the absence of a specific statement, that such names are exempt from the relevant protective laws and regulations and therefore free for general use. The publisher, the authors and the editors are safe to assume that the advice and information in this book are believed to be true and accurate at the date of publication. Neither the publisher nor the authors or the editors give a warranty, express or implied, with respect to the material contained herein or for any errors or omissions that may have been made. The publisher remains neutral with regard to jurisdictional claims in published maps and institutional affiliations. Printed on acid-free paper This Springer imprint is published by Springer Nature The registered company is Springer International Publishing AG The registered company address is: Gewerbestrasse 11, 6330 Cham, Switzerland
Preface
There is a lot of buzz in the industry about More-than-Moore technology directions, and especially the 2.5D and 3D System in Package (SiP) integration options. In principle, More-than-Moore integration, and 2.5D and 3D SiP implementation, is an opportunity that can be leveraged to extend system level miniaturization without More-Moore type of scaling, and to bring incremental cost-power-performance value. At a superficial level, it would appear that the SiP concept of integrating multiple die in a package—either by putting them side by side (2.5D integration) or on top of each other (3D integration)—is pretty straightforward, and not all that novel. This would seem especially so now that the key enabling foundational technology modules, such as the Through Si Vias and the uBumps, have been proven out, and are in volume manufacturing. After all, there are several announced SiP products that leverage the 2.5D and 3D integration technologies, and more are rumored to be coming. So, what is the big deal? However, in practice, implementation of competitive 2.5D and 3D SiPs for mainstream products—especially for cost conscious consumer market—is challenging. The entire IC product design and sourcing ecosystem, and the standard industry p
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